MMBD4448DW
SURFACE MOUNT SWITCHING DIODE
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Features
Mechanical Data
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Fast Switching Speed
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Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Surface Mount Package Ideally Suited for Automated Insertion
For General Purpose Switching Applications
High Conductance
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Ultra Miniature Package
Lead Free/RoHS Compliant (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Notes 4 and 5)
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
SOT-363
NC
C1
A2
A1
C2
NC
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
75
V
RMS Reverse Voltage
53
V
VR(RMS)
Forward Continuous Current
(Note 1)
(Note 1)
500
250
4
2
mA
mA
IFM
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
IO
@ t < 1μs
@ t < 1s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation
Symbol
PD
Value
200
Unit
mW
°C/W
°C
(Note 1)
(Note 1)
Thermal Resistance Junction to Ambient Air
Operating and Storage Temperature Range
625
Rθ
JA
-65 to +150
TJ , TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage
Symbol
V(BR)R
Min
75
Max
⎯
Unit
V
Test Condition
IR = 10μA
(Note 2)
IF = 5.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.62
⎯
⎯
0.720
0.855
1.0
Forward Voltage
Reverse Current
V
VF
1.25
⎯
VR = 75V
μA
μA
μA
nA
2.5
50
30
25
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
(Note 2)
IR
⎯
Total Capacitance
4.0
4.0
pF
CT
trr
⎯
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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www.diodes.com
February 2009
© Diodes Incorporated
MMBD4448DW
Document number: DS31035 Rev. 11 - 2