Datasheet > MCR89-130D-1.27DSA

MCR89-130D-1.27DSA

更新时间： 2024-11-22 22:22:43

品牌	Logo	应用领域
广濑 - HRS		插座
页数	文件大小	规格书
4页	137K
描述
Socket for Memory Module Board

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数据手册

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Socket for Memory Module Board

MCR89 Series

FEM Design

Simulation

Designed in Miniature 2

Contacts with High

Precision Spring

ꢀFeatures

1. High Reliability

4. Miniature Type and High Density Mounting

This socket achieves high reliability in the horizontal

contact spring system.

The low profile with 6.2mm height from the board is

suitable for miniaturization of equipment. The 1.27mm pitch

between contacts assures mounting with high density.

2. Low Insertion Force

5. Wide Effective Mounting Area

This socket prevents mis-insertion force in the preload

structure.

This socket is capable of widening the effective mounting

area on the module printed board, and secures retention

function by easy locking.

3. Easy Pattern Design

6. Easy Board Mounting

The dip contact through-hole diameter is only 0.5, and

simplifies the pattern design.

The fixing pins are arranged in the same alignment as the

contact, so as to easily install the connector in the board.

7. Accessories

Dust covers and jigs to remove the board are available.

ꢀProduct Specifications

Current rating: 0.5A

Operating Temperature Range: -30 to +85 (Note 1) Storage Temperature Range: -10 to +60 (Note 2)

Rating

Voltage rating: 125V AC

Operating Humidity Range: 40 to 80%

Storage Temperature Range: 40 to 70% (Note 2)

Item

Specification

Conditions

1. Contact Resistance

2. Withstanding voltage

3. Insulation Resistance

4. Vibration

ohms min.

500A DC

1000M

No flashover or insulation breakdown.

ohms max.

500V DC / 1 minute

100mA

20m

No electrical discontinuity of 10 µs or more

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.

96 hours at temperature of 40ç and humidity of 90% to 95%

5 cycles under following condition;

5. Humidity (Steady state)

Insulation Resistance:1000M ohms min.

6. Temperature Cycle

No damage, cracks, or parts looseness.

Temperature : -55: 30 minutes +5 to 35ç: 5 minutes max.

ꢀ ꢀ

200 cycles

Manual soldering: 300

: 30 minutes 15- to 30ç 5 minutes max.)

ꢀ

7. Durability (Insertion/withdrawal)

ohms max.

Contact resistance: 20m

for 3 seconds

8. Resistance to Soldering heat No deformation of components affecting performance.

Note 1: Includes temperature rise caused by current flow.

Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range

and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.

12 3 4

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与MCR89-130D-1.27DSA相关器件

型号	品牌	获取价格	描述	数据表
MCR89-130D-1.27DSA(01)	HRS	获取价格	Card Edge Connector, 130 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder T
MCR89-130D-1.27DSC	HRS	获取价格	Socket for Memory Module Board
MCR89-130D-1.27DSC(01)	HRS	获取价格	Card Edge Connector, 130 Contact(s), 2 Row(s), Female, Straight, 0.05 inch Pitch, Solder T
MCR89-130D-DC	HRS	获取价格	Socket for Memory Module Board
MCR89-130D-EJ	HRS	获取价格	Socket for Memory Module Board
MCR8D	MOTOROLA	获取价格	Silicon Controlled Rectifier, 8A I(T)RMS, 8000mA I(T), 400V V(DRM), 400V V(RRM), 1 Element
MCR8D-AF	MOTOROLA	获取价格	Silicon Controlled Rectifier, 8A I(T)RMS, 400V V(DRM), 400V V(RRM), 1 Element, TO-220AB
MCR8D-AJ	MOTOROLA	获取价格	8A, 400V, SCR, TO-220AB
MCR8D-AK	MOTOROLA	获取价格	8A, 400V, SCR, TO-220AB
MCR8D-AN	MOTOROLA	获取价格	Silicon Controlled Rectifier, 8A I(T)RMS, 400V V(DRM), 400V V(RRM), 1 Element, TO-220AB

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