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MCR89-130D-1.27DSC PDF预览

MCR89-130D-1.27DSC

更新时间: 2024-11-25 22:24:31
品牌 Logo 应用领域
广濑 - HRS 插座
页数 文件大小 规格书
4页 137K
描述
Socket for Memory Module Board

MCR89-130D-1.27DSC 数据手册

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Socket for Memory Module Board  
MCR89 Series  
FEM Design  
Simulation  
Designed in Miniature 2  
Contacts with High  
Precision Spring  
Features  
1. High Reliability  
4. Miniature Type and High Density Mounting  
This socket achieves high reliability in the horizontal  
contact spring system.  
The low profile with 6.2mm height from the board is  
suitable for miniaturization of equipment. The 1.27mm pitch  
between contacts assures mounting with high density.  
2. Low Insertion Force  
5. Wide Effective Mounting Area  
This socket prevents mis-insertion force in the preload  
structure.  
This socket is capable of widening the effective mounting  
area on the module printed board, and secures retention  
function by easy locking.  
3. Easy Pattern Design  
Ø
6. Easy Board Mounting  
The dip contact through-hole diameter is only 0.5, and  
simplifies the pattern design.  
The fixing pins are arranged in the same alignment as the  
contact, so as to easily install the connector in the board.  
7. Accessories  
Dust covers and jigs to remove the board are available.  
Product Specifications  
Current rating: 0.5A  
Operating Temperature Range: -30 to +85 (Note 1) Storage Temperature Range: -10 to +60 (Note 2)  
ç
ç
Rating  
Voltage rating: 125V AC  
Operating Humidity Range: 40 to 80%  
Storage Temperature Range: 40 to 70% (Note 2)  
Item  
Specification  
Conditions  
1. Contact Resistance  
2. Withstanding voltage  
3. Insulation Resistance  
4. Vibration  
ohms min.  
500A DC  
1000M  
No flashover or insulation breakdown.  
ohms max.  
500V DC / 1 minute  
100mA  
20m  
No electrical discontinuity of 10 µs or more  
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.  
96 hours at temperature of 40ç and humidity of 90% to 95%  
5 cycles under following condition;  
5. Humidity (Steady state)  
Insulation Resistance:1000M ohms min.  
6. Temperature Cycle  
No damage, cracks, or parts looseness.  
Temperature : -55: 30 minutes +5 to 35ç: 5 minutes max.  
ꢀ ꢀ  
85  
200 cycles  
Manual soldering: 300  
ç
: 30 minutes 15- to 30ç 5 minutes max.)  
7. Durability (Insertion/withdrawal)  
ohms max.  
Contact resistance: 20m  
ç
for 3 seconds  
8. Resistance to Soldering heat No deformation of components affecting performance.  
Note 1: Includes temperature rise caused by current flow.  
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range  
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.  
D2  

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