Order this document
by MCR8DCM/D
SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Devices
Reverse Blocking Thyristors
Designed for high volume, low cost, industrial and consumer applications
such as motor control; process control; temperature, light and speed control.
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•
•
•
Small Size
SCRs
8.0 AMPERES RMS
600 thru 800 VOLTS
Passivated Die for Reliability and Uniformity
Low Level Triggering and Holding Characteristics
A
K
Available in Two Package Styles
Surface Mount Lead Form — Case 369A
Miniature Plastic Package — Straight Leads — Case 369
A
G
ORDERING INFORMATION
•
K
To Obtain “DPAK” in Surface Mount Leadform (Case 369A)
Shipped in Sleeves — No Suffix, i.e. MCR8DCN
Shipped in 16 mm Tape and Reel — Add “T4” Suffix to Device Number,
i.e. MCR8DCNT4
G
A
CASE 369A–13
STYLE 4
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To Obtain “DPAK” in Straight Lead Version (Case 369) Shipped in Sleeves —
Add “–1” Suffix to Device Number, i.e. MCR8DCN–1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
Unit
(1)
Peak Repetitive Off–State Voltage
Peak Repetitive Reverse Voltage
(T = –40 to 125°C)
J
V
DRM
V
RRM
Volts
MCR8DCM
MCR8DCN
600
800
On–State RMS Current
(All Conduction Angles; T = 105°C)
I
T(RMS)
Amps
8.0
5.1
C
Average On–State Current (All Conduction Angles; T = 105°C)
I
T(AV)
C
Peak Non–Repetitive Surge Current
I
TSM
(One Half Cycle, 60 Hz, T = 125°C)
80
26
J
2
I t
2
Circuit Fusing Consideration (t = 8.3 msec)
A sec
Peak Gate Power
(Pulse Width ≤ 10 sec, T = 105°C)
P
GM
Watts
5.0
C
Average Gate Power
P
G(AV)
(t = 8.3 msec, T = 105°C)
0.5
C
Peak Gate Current (Pulse Width ≤ 10 sec, T = 105°C)
I
2.0
Amps
C
GM
Operating Junction Temperature Range
Storage Temperature Range
THERMAL CHARACTERISTICS
Characteristic
T
J
–40 to 125
–40 to 150
°C
T
stg
Symbol
Max
Unit
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
R
R
R
2.2
88
80
°C/W
JC
JA
JA
(2)
Thermal Resistance — Junction to Ambient
Maximum Lead Temperature for Soldering Purposes
(1) V
(3)
T
260
°C
L
for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall not be
DRM
applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the
voltage ratings of the device are exceeded.
(2) Surface mounted on minimum recommended pad size.
(3) 1/8″ from case for 10 seconds.
Preferred devices are Motorola recommended choices for future use and best overall value.
1
Motorola Thyristor Device Data
Motorola, Inc. 1997