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M54HCT374K PDF预览

M54HCT374K

更新时间: 2024-11-02 19:34:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 逻辑集成电路触发器
页数 文件大小 规格书
29页 301K
描述
IC,FLIP-FLOP,OCTAL,D TYPE,CMOS, RAD HARD,FP,20PIN,CERAMIC

M54HCT374K 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:DFP, FL20,.4Reach Compliance Code:not_compliant
风险等级:5.83JESD-30 代码:R-XDFP-F20
逻辑集成电路类型:D FLIP-FLOP功能数量:8
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
封装主体材料:CERAMIC封装代码:DFP
封装等效代码:FL20,.4封装形状:RECTANGULAR
封装形式:FLATPACK电源:5 V
认证状态:Not Qualified子类别:FF/Latches
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL总剂量:50k Rad(Si) V
触发器类型:POSITIVE EDGEBase Number Matches:1

M54HCT374K 数据手册

 浏览型号M54HCT374K的Datasheet PDF文件第2页浏览型号M54HCT374K的Datasheet PDF文件第3页浏览型号M54HCT374K的Datasheet PDF文件第4页浏览型号M54HCT374K的Datasheet PDF文件第5页浏览型号M54HCT374K的Datasheet PDF文件第6页浏览型号M54HCT374K的Datasheet PDF文件第7页 
M54HCxxx  
M54HCTxxx  
Rad-hard high speed 2 to 6 V CMOS logic series  
Features  
2 to 6 V operating voltage  
Low power DC dissipation: 1 µA max at 25°C  
High speed t = 8 ns typ at 25°C  
PD  
Symmetrical outputs characteristics  
Flat-14  
Flat-16  
DIL-14  
DIL-16  
High noise immunity: 28% of min V  
Hermetic packages  
CC  
Rad-hard 50 krad (Si)  
SEL immune up to 110 MeV/mg/cm²  
ESCC qualified  
Same die and electrical specification for  
engineering and flight models  
The complete specification of each type is  
available from the ESCC web site:  
https://escies.org using its ESCC part number.  
ST guarantees full compliance of qualified  
parts with these ESCC specifications  
Description  
Flat-20  
Flat-24  
DIL-20  
DIL-24  
The M54HCxxx and M54HCTxxx series are  
composed of over 90 types of high speed CMOS  
functions specifically designed to meet the  
radiation requirements of the aerospace industry.  
It includes a large set of gates, Flip-Flops,  
Multiplexers, Counters, Bus interface and several  
other functions. The radiation hardness, the single  
event latch-up (SEL) immunity and the housing in  
hermetic packages of all types of both series  
make them ideally suited for use in the most  
difficult environmental conditions.  
The upper metallic lid is not electrically connected to any  
pins, nor to the IC die inside the package.  
August 2011  
Doc ID 17367 Rev 2  
1/29  
www.st.com  
29  

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