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K9F2G08U0A-ICB00 PDF预览

K9F2G08U0A-ICB00

更新时间: 2024-11-25 15:44:19
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
44页 999K
描述
Flash, 256MX8, 30ns, PBGA52, 12 X 17 MM, 1 MM PITCH, LEAD FREE, ULGA-52

K9F2G08U0A-ICB00 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:LGA包装说明:12 X 17 MM, 1 MM PITCH, LEAD FREE, ULGA-52
针数:52Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.77最长访问时间:30 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PBGA-B52长度:17 mm
内存密度:2147483648 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:2K端子数量:52
字数:268435456 words字数代码:256000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:256MX8
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:LGA52(UNSPEC)封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH页面大小:2K words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V编程电压:1.8 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:0.65 mm部门规模:128K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO类型:SLC NAND TYPE
宽度:12 mmBase Number Matches:1

K9F2G08U0A-ICB00 数据手册

 浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第2页浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第3页浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第4页浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第5页浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第6页浏览型号K9F2G08U0A-ICB00的Datasheet PDF文件第7页 
K9F2G08R0A  
K9F2G08U0A  
FLASH MEMORY  
K9F2G08UXA  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
1

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K9F2G08U0A-ICB0T SAMSUNG

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Flash, 256MX8, 20ns, PBGA52
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K9F2G08U0A-IIB00 SAMSUNG

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Flash, 256MX8, 30ns, PBGA52, 12 X 17 MM, 1 MM PITCH, LEAD FREE, ULGA-52
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K9F2G08U0A-P SAMSUNG

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FLASH MEMORY
K9F2G08U0A-PCB0 SAMSUNG

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Flash, 256MX8, 20ns, PDSO48
K9F2G08U0A-PCB00 SAMSUNG

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Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48
K9F2G08U0A-PCB0T SAMSUNG

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Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48
K9F2G08U0A-PIB0 SAMSUNG

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Flash, 256MX8, 20ns, PDSO48,
K9F2G08U0A-PIB00 SAMSUNG

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Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48