是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Contact Manufacturer | 包装说明: | TSSOP, TSSOP48,.8,20 |
Reach Compliance Code: | compliant | 风险等级: | 5.62 |
最长访问时间: | 30 ns | 命令用户界面: | YES |
数据轮询: | NO | JESD-30 代码: | R-PDSO-G48 |
JESD-609代码: | e0 | 内存密度: | 2147483648 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
湿度敏感等级: | 3 | 部门数/规模: | 2K |
端子数量: | 48 | 字数: | 268435456 words |
字数代码: | 256000000 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 256MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP48,.8,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 页面大小: | 2K words |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 240 |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
就绪/忙碌: | YES | 部门规模: | 128K |
最大待机电流: | 0.00005 A | 子类别: | Flash Memories |
最大压摆率: | 0.03 mA | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 切换位: | NO |
类型: | NAND TYPE | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F2G08U0M-YIB00 | SAMSUNG |
获取价格 |
Flash, 256MX8, 20ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F2G08U0M-YIB0T | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48 | |
K9F2G08UXA | SAMSUNG |
获取价格 |
FLASH MEMORY | |
K9F2G16Q0M | SAMSUNG |
获取价格 |
FLASH MEMORY | |
K9F2G16Q0M-PCB0 | SAMSUNG |
获取价格 |
Flash, 128MX16, 45ns, PDSO48, | |
K9F2G16Q0M-PCB00 | SAMSUNG |
获取价格 |
Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9F2G16Q0M-PIB0 | SAMSUNG |
获取价格 |
Flash, 128MX16, 45ns, PDSO48, | |
K9F2G16Q0M-YIB00 | SAMSUNG |
获取价格 |
Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F2G16U0M | SAMSUNG |
获取价格 |
FLASH MEMORY | |
K9F2G16U0M-PCB00 | SAMSUNG |
获取价格 |
Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |