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K9F2G16U0M-YIB0 PDF预览

K9F2G16U0M-YIB0

更新时间: 2024-11-26 08:45:31
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路
页数 文件大小 规格书
41页 1018K
描述
Flash, 128MX16, 30ns, PDSO48,

K9F2G16U0M-YIB0 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP, TSSOP48,.8,20Reach Compliance Code:compliant
风险等级:5.92最长访问时间:30 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
内存密度:2147483648 bit内存集成电路类型:FLASH
内存宽度:16部门数/规模:2K
端子数量:48字数:134217728 words
字数代码:128000000最高工作温度:85 °C
最低工作温度:-40 °C组织:128MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH页面大小:1K words
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:64K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.03 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL切换位:NO
类型:NAND TYPEBase Number Matches:1

K9F2G16U0M-YIB0 数据手册

 浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第2页浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第3页浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第4页浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第5页浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第6页浏览型号K9F2G16U0M-YIB0的Datasheet PDF文件第7页 
K9K4G08U1M  
K9F2G08U0M K9F2G16U0M  
FLASH MEMORY  
Document Title  
256M x 8 Bit / 128M x 16 Bit / 512M x 8 Bit NAND Flash Memory  
Revision History  
Revision No History  
Draft Date  
Remark  
0.0  
0.1  
1. Initial issue  
Sep. 19.2001  
Advance  
Nov. 22. 2002  
Preliminary  
1. Add the Rp vs tr ,tf & Rp vs Ibusy graph for 1.8V device (Page 34)  
2. Add the data protection Vcc guidence for 1.8V device - below about  
1.1V. (Page 35)  
Mar. 6.2003  
Apr. 2. 2003  
Preliminary  
Preliminary  
0.2  
0.3  
The min. Vcc value 1.8V devices is changed.  
K9F2GXXQ0M : Vcc 1.65V~1.95V --> 1.70V~1.95V  
Few current value is changed.  
Before  
Unit : us  
K9F2GXXU0M  
K9F2GXXQ0M  
Typ.  
Max.  
100  
±20  
±20  
Typ.  
Max.  
100  
±20  
±20  
ISB2  
20  
-
20  
-
ILI  
ILO  
-
-
After  
K9F2GXXQ0M  
K9F2GXXU0M  
Typ.  
Max.  
50  
Typ.  
Max.  
50  
ISB2  
ILI  
10  
-
10  
-
±10  
±10  
±10  
±10  
ILO  
-
-
0.4  
1. The 3rd Byte ID after 90h ID read command is don’t cared.  
The 5th Byte ID after 90h ID read command is deleted.  
2. Note is added.  
Apr. 9. 2003  
Preliminary  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
3. Pb-free Package is added.  
K9F2G08Q0M-PCB0,PIB0  
K9F2G08U0M-PCB0,PIB0  
K9F2G16U0M-PCB0,PIB0  
K9F2G16Q0M-PCB0,PIB0  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near your office.  
1

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