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K9F3208W0A-TCS00 PDF预览

K9F3208W0A-TCS00

更新时间: 2024-11-25 20:53:43
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路
页数 文件大小 规格书
23页 432K
描述
Flash, 4MX8, 35ns, PDSO40, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40

K9F3208W0A-TCS00 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2,针数:44
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.84
最长访问时间:35 ns其他特性:CONTAINS ADDITIONAL 128K X 8 BIT NAND FLASH
JESD-30 代码:R-PDSO-G40长度:18.41 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:40字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

K9F3208W0A-TCS00 数据手册

 浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第2页浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第3页浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第4页浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第5页浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第6页浏览型号K9F3208W0A-TCS00的Datasheet PDF文件第7页 
K9F3208W0A-TCS0  
FLASH MEMORY  
Document Title  
4M x 8 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial issue.  
April 10th 1998  
Advanced  
Information  
Final  
0.1  
Data Sheet, 1999  
April 10th 1999  
1) Added CE dont’ care mode during the data-loading and reading  
2) Removed erase suspend/resume mode  
0.2  
Changed device name  
Sep. 15th 1999  
Final  
- KM29W32000ATS -> K9F3208W0A-TCS0  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
1

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