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K9F2G16U0M-PCB00 PDF预览

K9F2G16U0M-PCB00

更新时间: 2024-11-25 15:43:19
品牌 Logo 应用领域
三星 - SAMSUNG ISM频段光电二极管内存集成电路
页数 文件大小 规格书
41页 1018K
描述
Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

K9F2G16U0M-PCB00 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1, TSSOP48,.8,20
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最长访问时间:30 ns
其他特性:CONTAINS ADDITIONAL 64M BIT NAND FLASH命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PDSO-G48
JESD-609代码:e6长度:18.4 mm
内存密度:2147483648 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1部门数/规模:2K
端子数量:48字数:134217728 words
字数代码:128000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
页面大小:1K words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3/3.3 V
编程电压:2.7 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:64K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.03 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN BISMUTH端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:NO
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

K9F2G16U0M-PCB00 数据手册

 浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第2页浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第3页浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第4页浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第5页浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第6页浏览型号K9F2G16U0M-PCB00的Datasheet PDF文件第7页 
K9K4G08U1M  
K9F2G08U0M K9F2G16U0M  
FLASH MEMORY  
Document Title  
256M x 8 Bit / 128M x 16 Bit / 512M x 8 Bit NAND Flash Memory  
Revision History  
Revision No History  
Draft Date  
Remark  
0.0  
0.1  
1. Initial issue  
Sep. 19.2001  
Advance  
Nov. 22. 2002  
Preliminary  
1. Add the Rp vs tr ,tf & Rp vs Ibusy graph for 1.8V device (Page 34)  
2. Add the data protection Vcc guidence for 1.8V device - below about  
1.1V. (Page 35)  
Mar. 6.2003  
Apr. 2. 2003  
Preliminary  
Preliminary  
0.2  
0.3  
The min. Vcc value 1.8V devices is changed.  
K9F2GXXQ0M : Vcc 1.65V~1.95V --> 1.70V~1.95V  
Few current value is changed.  
Before  
Unit : us  
K9F2GXXU0M  
K9F2GXXQ0M  
Typ.  
Max.  
100  
±20  
±20  
Typ.  
Max.  
100  
±20  
±20  
ISB2  
20  
-
20  
-
ILI  
ILO  
-
-
After  
K9F2GXXQ0M  
K9F2GXXU0M  
Typ.  
Max.  
50  
Typ.  
Max.  
50  
ISB2  
ILI  
10  
-
10  
-
±10  
±10  
±10  
±10  
ILO  
-
-
0.4  
1. The 3rd Byte ID after 90h ID read command is don’t cared.  
The 5th Byte ID after 90h ID read command is deleted.  
2. Note is added.  
Apr. 9. 2003  
Preliminary  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
3. Pb-free Package is added.  
K9F2G08Q0M-PCB0,PIB0  
K9F2G08U0M-PCB0,PIB0  
K9F2G16U0M-PCB0,PIB0  
K9F2G16Q0M-PCB0,PIB0  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near your office.  
1

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4M x 8 Bit NAND Flash Memory