是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP1 | 包装说明: | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |
针数: | 48 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.83 | JESD-30 代码: | R-PDSO-G48 |
长度: | 18.4 mm | 内存密度: | 2147483648 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 268435456 words | 字数代码: | 256000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 256MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 编程电压: | 3.3 V |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
宽度: | 12 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F2G08U0M | SAMSUNG |
获取价格 |
FLASH MEMORY |
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K9F2G08U0M-ICB00 | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PBGA52, 12 X 17 MM, 1 MM PITCH, ULGA-52 |
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K9F2G08U0M-IIB00 | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PBGA52, 12 X 17 MM, 1 MM PITCH, ULGA-52 |
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K9F2G08U0M-PCB0 | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48 |
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K9F2G08U0M-PCB00 | SAMSUNG |
获取价格 |
Flash, 256MX8, 20ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |
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K9F2G08U0M-PCB0T | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 |
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K9F2G08U0M-PIB0 | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48, |
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K9F2G08U0M-PIB0T | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48, |
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K9F2G08U0M-YCB0 | SAMSUNG |
获取价格 |
Flash, 256MX8, 30ns, PDSO48 |
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K9F2G08U0M-YCB00 | SAMSUNG |
获取价格 |
Flash, 256MX8, 20ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 |
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