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K9F2808U0B-D PDF预览

K9F2808U0B-D

更新时间: 2024-11-24 22:18:31
品牌 Logo 应用领域
三星 - SAMSUNG 闪存
页数 文件大小 规格书
29页 305K
描述
16M x 8 Bit NAND Flash Memory

K9F2808U0B-D 数据手册

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K9F2808U0B-YCB0,YIB0  
K9F2808Q0B-DCB0,DIB0  
K9F2808U0B-VCB0,VIB0 K9F2808U0B-DCB0,DIB0  
FLASH MEMORY  
Document Title  
16M x 8 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
0.2  
Initial issue.  
May 28’ th 2001  
Advance  
K9F2808U0B(3.3V device)’ s qualification is finished  
Jun. 30th 2001  
Jul. 30th 2001  
K9F2808Q0B (1.8V device)  
- Changed typical read operation current (Icc1) from 8mA to 5mA  
- Changed typical program operation current (Icc2) from 8mA to 5mA  
- Changed typical erase operation current (Icc3) from 8mA to 5mA  
- Changed typical program time(tPROG) from 200us to 300us  
- Changed ALE to RE Delay (ID read, tAR1) from 100ns to 20ns  
- Changed CLE hold time(tCLH) from 10ns to 15ns  
- Changed CE hold time(tCH) from 10ns to 15ns  
K9F2808Q0B  
: Preliminary  
- Changed ALE hold time(tALH) from 10ns to 15ns  
- Changed Data hold time(tDH) from 10ns to 15ns  
- Changed CE Access time(tCEA) from 45ns to 60ns  
- Changed Read cycle time(tRC) from 50ns to 70ns  
- Changed Write Cycle time(tWC) from 50ns to 70ns  
- Changed RE Access time(tREA) from 35ns to 40ns  
- Changed RE High Hold time(tREH) from 15ns to 20ns  
- Changed WE High Hold time(tWH) from 15ns to 20ns  
0.3  
1. Device Code is changed  
- TBGA package information : ’ B’ --> ’ D’  
Aug. 23th 2001  
ex) K9F2808Q0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0  
K9F2808U0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0  
2. VIH ,VIL of K9F2808Q0B(1.8 device) is changed  
(before revision)  
I/O pins  
VccQ-0.4  
VCC-0.4  
VccQ  
VCC  
Input High Voltage  
VIH  
VIL  
Except I/O pins  
-
-
Input Low Voltage,  
All inputs  
-
0
0.4  
(after revision)  
VccQ-0.4  
VccQ  
+0.3  
I/O pins  
Input High Voltage  
VIH  
VIL  
VCC  
+0.3  
Except I/O pins  
-
VCC-0.4  
-0.3  
-
-
Input Low Voltage,  
All inputs  
0.4  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’ s Flash web site.  
http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
1

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