生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA63,10X12,32 | 针数: | 63 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.77 |
最长访问时间: | 35 ns | 其他特性: | CONTAINS ADDITIONAL 512K X 8 BIT NAND FLASH |
命令用户界面: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PBGA-B63 | 长度: | 11 mm |
内存密度: | 134217728 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
部门数/规模: | 1K | 端子数量: | 63 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 16MX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA63,10X12,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 页面大小: | 512 words |
并行/串行: | PARALLEL | 电源: | 3.3 V |
编程电压: | 2.7 V | 认证状态: | Not Qualified |
就绪/忙碌: | YES | 座面最大高度: | 1 mm |
部门规模: | 16K | 最大待机电流: | 0.00005 A |
子类别: | Flash Memories | 最大压摆率: | 0.02 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 切换位: | NO |
类型: | SLC NAND TYPE | 宽度: | 9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F2808U0B-DCB00 | SAMSUNG |
获取价格 |
Flash, 16MX8, 35ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, TBGA-63 | |
K9F2808U0B-DIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-V | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-VCB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-VIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-VIB00 | SAMSUNG |
获取价格 |
Flash, 16MX8, 35ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, PLASTIC, WSOP1-48 | |
K9F2808U0B-Y | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-YCB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory | |
K9F2808U0B-YCB00 | SAMSUNG |
获取价格 |
Flash, 16MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F2808U0B-YIB0 | SAMSUNG |
获取价格 |
16M x 8 Bit NAND Flash Memory |