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K9F2808U0B-YIB00 PDF预览

K9F2808U0B-YIB00

更新时间: 2024-11-05 14:43:03
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路
页数 文件大小 规格书
30页 507K
描述
Flash, 16MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

K9F2808U0B-YIB00 技术参数

生命周期:Obsolete零件包装代码:TSOP1
包装说明:12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.77
Is Samacsys:N最长访问时间:35 ns
其他特性:CONTAINS ADDITIONAL 4M BIT SPARE MEMORYJESD-30 代码:R-PDSO-G48
长度:18.4 mm内存密度:134217728 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1端子数量:48
字数:16777216 words字数代码:16000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL编程电压:2.7 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL类型:NAND TYPE
宽度:12 mmBase Number Matches:1

K9F2808U0B-YIB00 数据手册

 浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第2页浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第3页浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第4页浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第5页浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第6页浏览型号K9F2808U0B-YIB00的Datasheet PDF文件第7页 
K9F2808Q0B  
K9F2808U0B  
FLASH MEMORY  
Document Title  
16M x 8 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
0.2  
Initial issue.  
May 28th 2001  
Advance  
K9F2808U0B(3.3V device)’s qualification is finished  
Jun. 30th 2001  
Jul. 30th 2001  
K9F2808Q0B (1.8V device)  
- Changed typical read operation current (Icc1) from 8mA to 5mA  
- Changed typical program operation current (Icc2) from 8mA to 5mA  
- Changed typical erase operation current (Icc3) from 8mA to 5mA  
- Changed typical program time(tPROG) from 200us to 300us  
- Changed ALE to RE Delay (ID read, tAR1) from 100ns to 20ns  
- Changed CLE hold time(tCLH) from 10ns to 15ns  
- Changed CE hold time(tCH) from 10ns to 15ns  
K9F2808Q0B  
: Preliminary  
- Changed ALE hold time(tALH) from 10ns to 15ns  
- Changed Data hold time(tDH) from 10ns to 15ns  
- Changed CE Access time(tCEA) from 45ns to 60ns  
- Changed Read cycle time(tRC) from 50ns to 70ns  
- Changed Write Cycle time(tWC) from 50ns to 70ns  
- Changed RE Access time(tREA) from 35ns to 40ns  
- Changed RE High Hold time(tREH) from 15ns to 20ns  
- Changed WE High Hold time(tWH) from 15ns to 20ns  
0.3  
1. Device Code is changed  
- TBGA package information : ’B’ --> ’D’  
Aug. 23th 2001  
ex) K9F2808Q0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0  
K9F2808U0B-BCB0 ,BIB0 --> K9F2808Q0B-DCB0,DIB0  
2. VIH ,VIL of K9F2808Q0B(1.8 device) is changed  
(before revision)  
I/O pins  
VccQ-0.4  
VCC-0.4  
VccQ  
VCC  
Input High Voltage  
VIH  
VIL  
Except I/O pins  
-
-
Input Low Voltage,  
All inputs  
-
0
0.4  
(after revision)  
VccQ-0.4  
VccQ+  
0.3  
I/O pins  
Input High Voltage  
VIH  
VIL  
VCC  
+0.3  
Except I/O pins  
-
VCC-0.4  
-0.3  
-
-
Input Low Voltage,  
All inputs  
0.4  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
1

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