5秒后页面跳转
K7N327245M-HC250 PDF预览

K7N327245M-HC250

更新时间: 2024-09-08 21:01:27
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
20页 242K
描述
ZBT SRAM, 512KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

K7N327245M-HC250 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:209
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:2.6 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PBGA-B209长度:22 mm
内存密度:37748736 bit内存集成电路类型:ZBT SRAM
内存宽度:72功能数量:1
端子数量:209字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX72封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:2.2 mm
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

K7N327245M-HC250 数据手册

 浏览型号K7N327245M-HC250的Datasheet PDF文件第2页浏览型号K7N327245M-HC250的Datasheet PDF文件第3页浏览型号K7N327245M-HC250的Datasheet PDF文件第4页浏览型号K7N327245M-HC250的Datasheet PDF文件第5页浏览型号K7N327245M-HC250的Datasheet PDF文件第6页浏览型号K7N327245M-HC250的Datasheet PDF文件第7页 
Preliminary  
K7N327245M  
512Kx72 Pipelined NtRAMTM  
Document Title  
512Kx72-Bit Pipelined NtRAMTM  
Revision History  
Draft Date  
Remark  
Rev. No.  
History  
Advance  
Preliminary  
May. 10. 2001  
Dec. 31. 2001  
0.0  
1. Initial document.  
0.1  
1. Speed bin merge.  
From K7N327249M to K7N327245M  
2. AC parameter change.  
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20  
Preliminary  
Feb. 11, 2003  
0.2  
1. Delete the speed bin (-22, -15, -13)  
2. Update the JTAG boundary scan exit order.  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Feb. 2003  
Rev 0.2  
- 1 -  

与K7N327245M-HC250相关器件

型号 品牌 获取价格 描述 数据表
K7N401801A SAMSUNG

获取价格

128Kx36 & 256Kx18-Bit Pipelined NtRAMTM
K7N401801A-QC13 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100
K7N401801A-QC13T SAMSUNG

获取价格

ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100
K7N401801A-QC15 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 3.8ns, CMOS, PQFP100
K7N401801A-QC16 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100
K7N401801A-QC16T SAMSUNG

获取价格

ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100
K7N401801A-TC13 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
K7N401801A-TC130 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
K7N401801A-TC15 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 3.8ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
K7N401801A-TC16 SAMSUNG

获取价格

ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100