是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA84,9X15,32 | Reach Compliance Code: | unknown |
风险等级: | 5.84 | 最长访问时间: | 0.4 ns |
最大时钟频率 (fCLK): | 400 MHz | I/O 类型: | COMMON |
交错的突发长度: | 4,8 | JESD-30 代码: | R-PBGA-B84 |
内存密度: | 1073741824 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 16 | 湿度敏感等级: | 3 |
端子数量: | 84 | 字数: | 67108864 words |
字数代码: | 64000000 | 组织: | 64MX16 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA84,9X15,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
刷新周期: | 8192 | 连续突发长度: | 4,8 |
最大待机电流: | 0.015 A | 子类别: | DRAMs |
最大压摆率: | 0.265 mA | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4T1G164QQ-HCE70 | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 | |
K4T1G164QQ-HCE7T | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84 | |
K4T1G164QQ-HCF7 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G164QQ-HCF7T | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84 | |
K4T1G164QQ-HCLE6 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G164QQ-HCLE7 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G164QQ-HCLF7 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G164QQ-HIE6 | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, | |
K4T1G164QQ-HIF70 | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | |
K4T1G164QQ-HLE6 | SAMSUNG |
获取价格 |
DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84 |