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K4T1G313QI-MCF70 PDF预览

K4T1G313QI-MCF70

更新时间: 2024-11-20 21:12:31
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
44页 926K
描述
DDR DRAM, 32MX32, 0.4ns, CMOS, PBGA128, HALOGEN FREE AND ROHS COMPLIANT, FBGA-128

K4T1G313QI-MCF70 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:128
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.32风险等级:5.84
访问模式:MULTI BANK PAGE BURST最长访问时间:0.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B128
长度:13.5 mm内存密度:1073741824 bit
内存集成电路类型:DDR DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:128字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:95 °C最低工作温度:
组织:32MX32封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:10.5 mm
Base Number Matches:1

K4T1G313QI-MCF70 数据手册

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DDR2 SDRAM  
K4T1G313QI  
1Gb x32 I-die DDR2 SDRAM Specification  
128FBGA with Lead-Free & Halogen-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE  
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-  
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-  
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT  
GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
1 of 44  
Rev. 1.0 August 2009  

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