生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 128 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.32 | 风险等级: | 5.84 |
访问模式: | MULTI BANK PAGE BURST | 最长访问时间: | 0.4 ns |
其他特性: | AUTO/SELF REFRESH | JESD-30 代码: | R-PBGA-B128 |
长度: | 13.5 mm | 内存密度: | 1073741824 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 32 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 128 | 字数: | 33554432 words |
字数代码: | 32000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 95 °C | 最低工作温度: | |
组织: | 32MX32 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 自我刷新: | YES |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 宽度: | 10.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4T28163QO | SAMSUNG |
获取价格 |
Consumer Memory | |
K4T28163QP-BCE6 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.45ns, CMOS, PBGA84 | |
K4T28163QP-BCE60 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.45ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | |
K4T28163QP-BCE7 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.4ns, CMOS, PBGA84 | |
K4T28163QP-BCE70 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.4ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | |
K4T28163QP-BCF70 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.4ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | |
K4T28163QP-BCF80 | SAMSUNG |
获取价格 |
DDR DRAM, 8MX16, 0.35ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | |
K4T2G044QA-HCE7 | SAMSUNG |
获取价格 |
暂无描述 | |
K4T2G044QA-HCE70 | SAMSUNG |
获取价格 |
DDR DRAM, 512MX4, 0.4ns, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68 | |
K4T2G044QA-HCF7T | SAMSUNG |
获取价格 |
Cache DRAM Module, 512MX4, 0.4ns, CMOS, PBGA68 |