JMTG100N06D
Figure 8: Normalized on Resistance vs.
Figure 7: Normalized Breakdown Voltage vs.
Junction Temperature
Junction Temperature
VBR(DSS)
RDS(on)
2.5
1.3
1.2
2.0
1.5
1.1
1.0
1.0
0.5
0.9
0
Tj (℃)
Tj (℃)
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
Figure 9: Maximum Safe Operating Area
Figure 10: Maximum Continuous Drain Current
vs. Case Temperature
ID(A)
ID(A)
60
103
Limited by RDS(on)
50
40
30
20
10μs
102
100μs
1ms
101
100
10ms
100ms
DC
TC=25℃
10
0
Single pulse
Tc (℃)
10-1
VDS (V)
10
0.1
1
100
0
25
50
75
100
125
150
Figure.11: Maximum Effective
Transient Thermal Impedance, Junction-to-Case
ZthJ-C(℃/W)
101
100
10-1
D=0.5
D=0.2
t1
D=0.1
t2
D=0.05
D=0.02
D=0.01
Single pulse
10-2
10-3
Notes:
1.Duty factor D=t1/t2
2.Peak TJ=PDM*ZthJC+TC
TP(s)
10-2
10-6
10-5
10-4
10-3
10-1
100
101
JieJie Microelectronics CO. , Ltd
Version :1.0
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