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IRLR8715CPBF PDF预览

IRLR8715CPBF

更新时间: 2024-11-01 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 274K
描述
HEXFET Power MOSFET

IRLR8715CPBF 数据手册

 浏览型号IRLR8715CPBF的Datasheet PDF文件第2页浏览型号IRLR8715CPBF的Datasheet PDF文件第3页浏览型号IRLR8715CPBF的Datasheet PDF文件第4页浏览型号IRLR8715CPBF的Datasheet PDF文件第5页浏览型号IRLR8715CPBF的Datasheet PDF文件第6页浏览型号IRLR8715CPBF的Datasheet PDF文件第7页 
PD - 97107A  
IRLR8715CPbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom  
VDSS RDS(on) max  
Qg  
6.9nC  
9.4m  
25V  
:
D
Benefits  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
S
D
G
D-Pak  
l Lead-Free  
IRLR8715CPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Max.  
25  
Parameter  
Units  
V
VDS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
± 20  
51  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
D
@ TC = 100°C  
36  
200  
44  
A
D
DM  
Maximum Power Dissipation  
Maximum Power Dissipation  
P
P
@TC = 25°C  
W
D
D
@TC = 100°C  
22  
Linear Derating Factor  
Operating Junction and  
0.29  
-55 to + 175  
W/°C  
°C  
T
T
J
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
3.4  
Units  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
JC  
JA  
JA  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
–––  
50  
°C/W  
–––  
110  
Notes  through † are on page 10  
www.irf.com  
1
9/18/06  

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