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IRLR8713PBF PDF预览

IRLR8713PBF

更新时间: 2024-11-01 04:23:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 333K
描述
HEXFET Power MOSFET

IRLR8713PBF 数据手册

 浏览型号IRLR8713PBF的Datasheet PDF文件第2页浏览型号IRLR8713PBF的Datasheet PDF文件第3页浏览型号IRLR8713PBF的Datasheet PDF文件第4页浏览型号IRLR8713PBF的Datasheet PDF文件第5页浏览型号IRLR8713PBF的Datasheet PDF文件第6页浏览型号IRLR8713PBF的Datasheet PDF文件第7页 
PD - 97067  
IRLR8713PbF  
IRLU8713PbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
VDSS RDS(on) max  
Qg  
4.8m:  
25V  
17.4nC  
D
D
Benefits  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
S
D
S
D
G
G
D-Pak  
IRLR8713PbF  
I-Pak  
IRLU8713PbF  
l Lead-Free  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain-to-Source Voltage  
25  
V
V
Gate-to-Source Voltage  
± 20  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
100  
I
I
I
@ TC = 25°C  
D
D
72  
@ TC = 100°C  
A
410  
81  
DM  
Maximum Power Dissipation  
Maximum Power Dissipation  
P
P
@TC = 25°C  
W
D
D
@TC = 100°C  
40  
Linear Derating Factor  
Operating Junction and  
0.54  
W/°C  
°C  
T
T
-55 to + 175  
J
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
Max.  
1.86  
50  
Units  
RθJC  
RθJA  
RθJA  
–––  
–––  
–––  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
°C/W  
110  
Notes  through † are on page 10  
www.irf.com  
1
12/7/05  

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