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IRLR024TRRPBF

更新时间: 2024-11-25 13:01:43
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
10页 1204K
描述
Power Field-Effect Transistor, 14A I(D), 60V, 0.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, LEAD FREE, DPAK-3

IRLR024TRRPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-252AA
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.08其他特性:LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):91 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):14 A最大漏极电流 (ID):14 A
最大漏源导通电阻:0.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):42 W
最大脉冲漏极电流 (IDM):56 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLR024TRRPBF 数据手册

 浏览型号IRLR024TRRPBF的Datasheet PDF文件第2页浏览型号IRLR024TRRPBF的Datasheet PDF文件第3页浏览型号IRLR024TRRPBF的Datasheet PDF文件第4页浏览型号IRLR024TRRPBF的Datasheet PDF文件第5页浏览型号IRLR024TRRPBF的Datasheet PDF文件第6页浏览型号IRLR024TRRPBF的Datasheet PDF文件第7页 
IRLR024, IRLU024, SiHLR024, SiHLU024  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Surface Mount (IRLR024/SiHLR024)  
0.10  
R
DS(on) (Ω)  
VGS = 5.0 V  
RoHS*  
• Straight Lead (IRLU024/SiHLU024)  
COMPLIANT  
Qg (Max.) (nC)  
18  
4.5  
12  
• Available in Tape and Reel  
• Logic-Level Gate Drive  
• RDS(on) Specified at VGS = 4 V and 5 V  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
Configuration  
Single  
D
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
D
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRLU/SiHLU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
D
G
S
G
S
D
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
IRLR024TRPbFa  
SiHLR024T-E3a  
IRLR024TRa  
IPAK (TO-251)  
IRLU024PbF  
SiHLU024-E3  
IRLU024  
IRLR024PbF  
Lead (Pb)-free  
SiHLR024-E3  
IRLR024  
SnPb  
SiHLR024  
SiHLR024Ta  
SiHLU024  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
10  
V
VGS  
TC = 25 °C  
TC =100°C  
14  
Continuous Drain Current  
V
GS at 5.0 V  
ID  
9.2  
A
Pulsed Drain Currenta  
IDM  
56  
Linear Derating Factor  
0.33  
0.020  
91  
W/°C  
mJ  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
EAS  
PD  
T
C = 25 °C  
42  
W
TA = 25 °C  
2.5  
dV/dt  
4.5  
V/ns  
°C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 541 µH, RG = 25 Ω, IAS = 14 A (see fig. 12).  
c. ISD 17 A, dI/dt 140 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91322  
S-82993-Rev. B, 19-Jan-09  
www.vishay.com  
1

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