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IRLR120, IRLU120, SiHLR120, SiHLU120 PDF预览

IRLR120, IRLU120, SiHLR120, SiHLU120

更新时间: 2024-11-26 14:55:07
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威世 - VISHAY /
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描述
Power MOSFET

IRLR120, IRLU120, SiHLR120, SiHLU120 数据手册

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IRLR120, IRLU120, SiHLR120, SiHLU120  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Dynamic dV/dt rating  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
• Repetitive avalanche rated  
• Surface-mount (IRLR120, SiHLR120)  
• Straight lead (IRLU120, SiHLU120)  
D
D
G
• Available in tape and reMel  
Available  
• Logic-level gate drive  
S
G
S
• RDS(on) specified at VGS = 4 V and 5 V  
D
G
S
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
N-Channel MOSFET  
DESCRIPTION  
PRODUCT SUMMARY  
VDS (V)  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRLU, SiHLU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface-mount applications.  
100  
RDS(on) (Ω)  
VGS = 5.0 V  
0.27  
Qg (Max.) (nC)  
12  
3.0  
Q
gs (nC)  
gd (nC)  
Q
7.1  
Configuration  
Single  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
SiHLR120TRR-GE3  
-
IPAK (TO-251)  
SiHLR120-GE3  
SiHLR120TRL-GE3  
IRLR120TRLPbF-BE3  
IRLR120TRLPbF a  
SiHLR120TR-GE3  
IRLR120TRPbF-BE3  
IRLR120TRPbF a  
SiHLU120-GE3  
Lead (Pb)-free and  
halogen-free  
IRLR120PbF-BE3  
IRLR120PbF  
-
-
Lead (Pb)-free  
IRLR120TRRPbF a  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
100  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
10  
T
C = 25 °C  
7.7  
Continuous drain current  
VGS at 5 V  
ID  
TC = 100 °C  
4.9  
A
Pulsed drain current a  
IDM  
31  
Linear derating factor  
0.33  
0.020  
210  
W/°C  
Linear derating factor (PCB mount) e  
Single pulse avalanche energy b  
Repetitive avalanche current a  
EAS  
IAR  
mJ  
A
7.7  
Repetitive avalanche energy a  
EAR  
4.2  
mJ  
Maximum power dissipation  
T
C = 25 °C  
42  
PD  
W
V/ns  
°C  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dV/dt c  
TA = 25 °C  
2.5  
dV/dt  
5.5  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +150  
260  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 25 V, starting TJ = 25 °C, L = 5.3 mH, Rg = 25 Ω, IAS = 7.7 A (see fig. 12)  
c. ISD 9.2 A, dI/dt 110 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0818-Rev. F, 02-Aug-2021  
Document Number: 91324  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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