IRLR120, IRLU120, SiHLR120, SiHLU120
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Dynamic dV/dt rating
DPAK
(TO-252)
IPAK
(TO-251)
• Repetitive avalanche rated
• Surface-mount (IRLR120, SiHLR120)
• Straight lead (IRLU120, SiHLU120)
D
D
G
• Available in tape and reMel
Available
• Logic-level gate drive
S
G
S
• RDS(on) specified at VGS = 4 V and 5 V
D
G
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
N-Channel MOSFET
DESCRIPTION
PRODUCT SUMMARY
VDS (V)
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRLU, SiHLU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface-mount applications.
100
RDS(on) (Ω)
VGS = 5.0 V
0.27
Qg (Max.) (nC)
12
3.0
Q
gs (nC)
gd (nC)
Q
7.1
Configuration
Single
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
SiHLR120TRR-GE3
-
IPAK (TO-251)
SiHLR120-GE3
SiHLR120TRL-GE3
IRLR120TRLPbF-BE3
IRLR120TRLPbF a
SiHLR120TR-GE3
IRLR120TRPbF-BE3
IRLR120TRPbF a
SiHLU120-GE3
Lead (Pb)-free and
halogen-free
IRLR120PbF-BE3
IRLR120PbF
-
-
Lead (Pb)-free
IRLR120TRRPbF a
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
100
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
10
T
C = 25 °C
7.7
Continuous drain current
VGS at 5 V
ID
TC = 100 °C
4.9
A
Pulsed drain current a
IDM
31
Linear derating factor
0.33
0.020
210
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Repetitive avalanche current a
EAS
IAR
mJ
A
7.7
Repetitive avalanche energy a
EAR
4.2
mJ
Maximum power dissipation
T
C = 25 °C
42
PD
W
V/ns
°C
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
TA = 25 °C
2.5
dV/dt
5.5
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 25 V, starting TJ = 25 °C, L = 5.3 mH, Rg = 25 Ω, IAS = 7.7 A (see fig. 12)
c. ISD ≤ 9.2 A, dI/dt ≤ 110 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0818-Rev. F, 02-Aug-2021
Document Number: 91324
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000