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IRFSL9N60ATRR PDF预览

IRFSL9N60ATRR

更新时间: 2024-11-18 15:35:19
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
10页 239K
描述
Power Field-Effect Transistor, 9.2A I(D), 600V, 0.75ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-262AA, TO-262, 3 PIN

IRFSL9N60ATRR 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-262AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:compliant风险等级:5.1
雪崩能效等级(Eas):290 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (ID):9.2 A最大漏源导通电阻:0.75 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):37 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFSL9N60ATRR 数据手册

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IRFSL9N60A, SiHFSL9N60A  
Vishay Siliconix  
Power MOSFET  
FEATURES  
Halogen-free According to IEC 61249-2-21  
Definition  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
600  
RDS(on) ()  
VGS = 10 V  
0.75  
Qg (Max.) (nC)  
Qgs (nC)  
49  
13  
20  
• Improved Gate, Avalanche and Dynamic  
dV/dt Ruggedness  
Q
gd (nC)  
Configuration  
Single  
• Fully Characterized Capacitance and Avalanche Voltage  
and Current  
D
I2PAK  
(TO-262)  
• Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptable Power Supply  
• High Speed Power Switching  
• This Device is only for Through Hole Application  
G
S
S
D
APPLICABLE OFF LINE SMPS TOPOLOGIES  
• Active Clamped Forward  
G
N-Channel MOSFET  
• Main Switch  
ORDERING INFORMATION  
Package  
I2PAK (TO-262)  
Lead (Pb)-free and Halogen-free  
SiHFSL9N60A-GE3  
IRFSL9N60APbF  
SiHFSL9N60A-E3  
Lead (Pb)-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
600  
30  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
C = 100 °C  
9.2  
Continuous Drain Current  
VGS at 10 V  
ID  
T
5.8  
A
Pulsed Drain Currenta  
IDM  
37  
1.3  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
290  
9.2  
EAR  
17  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
170  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
5.0  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 6.8 mH, Rg = 25 , IAS = 9.2 A (see fig. 12).  
c. ISD 9.2 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90362  
S11-1045-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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