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IRFSL3004PBF PDF预览

IRFSL3004PBF

更新时间: 2024-11-24 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 458K
描述
HEXFET Power MOSFET

IRFSL3004PBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, PLASTIC, TO-262, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.68
雪崩能效等级(Eas):300 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (ID):195 A最大漏源导通电阻:0.00175 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):1310 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFSL3004PBF 数据手册

 浏览型号IRFSL3004PBF的Datasheet PDF文件第2页浏览型号IRFSL3004PBF的Datasheet PDF文件第3页浏览型号IRFSL3004PBF的Datasheet PDF文件第4页浏览型号IRFSL3004PBF的Datasheet PDF文件第5页浏览型号IRFSL3004PBF的Datasheet PDF文件第6页浏览型号IRFSL3004PBF的Datasheet PDF文件第7页 
PD - 97377  
IRFB3004PbF  
IRFS3004PbF  
IRFSL3004PbF  
HEXFET® Power MOSFET  
Applications  
D
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
VDSS  
RDS(on) typ.  
max.  
40V  
1.4m  
1.75m  
G
ID  
340A  
c
(Silicon Limited)  
Benefits  
ID  
195A  
S
(Package Limited)  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
D
D
D
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
S
S
D
D
G
G
G
D2Pak  
IRFS3004PbF  
TO-220AB  
IRFB3004PbF  
TO-262  
IRFSL3004PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
340c  
240c  
195  
Units  
A
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current d  
1310  
PD @TC = 25°C  
380  
W
Maximum Power Dissipation  
2.5  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
4.4  
Peak Diode Recovery f  
dv/dt  
TJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
300  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Mounting torque, 6-32 or M3 screw  
10lbfxin (1.1Nxm)  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
300  
mJ  
A
Avalanche Currentꢀd  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy d  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case kl  
Typ.  
–––  
Max.  
0.40  
–––  
62  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
0.50  
–––  
Case-to-Sink, Flat Greased Surface, TO-220  
°C/W  
Junction-to-Ambient, TO-220  
2
–––  
40  
Junction-to-Ambient (PCB Mount) , D Pak  
j
www.irf.com  
1
02/26/09  

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