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IRFR9214PBF PDF预览

IRFR9214PBF

更新时间: 2024-11-06 05:39:31
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 156K
描述
Power MOSFET

IRFR9214PBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-252AA
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:6 weeks风险等级:5.06
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:186849Samacsys Pin Count:3
Samacsys Part Category:Integrated CircuitSamacsys Package Category:TO-XXX (Inc. DPAK)
Samacsys Footprint Name:TO-252AASamacsys Released Date:2015-12-27 16:31:34
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):100 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):2.8 A最大漏极电流 (ID):2.7 A
最大漏源导通电阻:3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):50 W
最大脉冲漏极电流 (IDM):11 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR9214PBF 数据手册

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IRFR9214, IRFU9214, SiHFR9214, SiHFU9214  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• P-Channel  
- 250  
Available  
• Surface Mount (IRFR9214/SiHFR9214)  
R
DS(on) (Ω)  
VGS = - 10 V  
3.0  
• Straight Lead (IRFU9214/SiHFU9214)  
• Advanced Process Technology  
• Fast Switching  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
14  
3.1  
6.8  
Q
Q
gs (nC)  
gd (nC)  
• Fully Avalanche Rated  
Configuration  
Single  
• Lead (Pb)-free Available  
S
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
G
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR9214TRPbFa  
SiHFR9214T-E3a  
IRFR9214TRa  
IPAK (TO-251)  
IRFU9214PbF  
SiHFU9214-E3  
IRFU9214  
IRFR9214PbF  
SiHFR9214-E3  
IRFR9214  
IRFR9214TRLPbFa  
SiHFR9214TL-E3a  
IRFR9214TRLa  
Lead (Pb)-free  
SnPb  
SiHFR9214  
SiHFR9214TLa  
SiHFR9214Ta  
SiHFU9214  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 250  
20  
V
VGS  
T
C = 25 °C  
- 2.7  
Continuous Drain Current  
VGS at - 10 V  
ID  
TC =100°C  
- 1.7  
- 11  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.40  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
100  
- 2.7  
EAR  
5.0  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
50  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
- 5.0  
- 55 to + 150  
260d  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 27 mH, RG = 25 Ω, IAS = - 2.7 A (see fig. 12).  
c. ISD - 2.7 A, dI/dt 600 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91282  
S-81392-Rev. A, 07-Jul-08  
www.vishay.com  
1

IRFR9214PBF 替代型号

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