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IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 PDF预览

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220

更新时间: 2024-11-07 14:54:23
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威世 - VISHAY /
页数 文件大小 规格书
13页 778K
描述
Power MOSFET

IRFR9220, IRFU9220, SiHFR9220, SiHFU9220 数据手册

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IRFR9220, IRFU9220, SiHFR9220, SiHFU9220  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
S
• Dynamic dV/dt rating  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
• Repetitive avalanche rated  
• Surface-mount (IRFR9220, SiHFR9220)  
• Straight lead (IRFUFU9220, SiHFU9220)  
G
D
D
Available  
• Available in tape and reel  
S
• P-channel  
G
S
D
G
• Fast switching  
D
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
P-Channel MOSFET  
PRODUCT SUMMARY  
DESCRIPTION  
VDS (V)  
-200  
Third power MOSFETs technology is the key to Vishay  
advanced line of Power MOSFET transistors. The efficient  
geometry and unique processing of the Power MOSFETs  
design achieve very low on-state resistance combined with  
high transconductance and extreme device ruggedness.  
RDS(on) (Ω)  
VGS = -10 V  
1.5  
Qg (Max.) (nC)  
20  
3.3  
Q
gs (nC)  
gd (nC)  
Q
11  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU, SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface-mount applications.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
IPAK (TO-251)  
SiHFR9220-GE3  
SiHFR9220TRL-GE3 a SiHFR9220TRR-GE3 a SiHFR9220TR-GE3 a SiHFU9220-GE3  
Lead (Pb)-free and  
halogen-free  
IRFR9220PbF-BE3 IRFR9220TRPbF-BE3  
IRFR9220PbF  
IRFR9220TRLPbFa  
-
-
-
Lead (Pb)-free  
IRFR9220TRRPbFa  
IRFR9220TRPbFa  
IRFU9220PbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-200  
20  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
T
C = 25 °C  
-3.6  
Continuous drain current  
VGS at -10 V  
ID  
TC = 100 °C  
-2.3  
A
Pulsed drain current a  
IDM  
-14  
Linear derating factor  
0.33  
0.020  
310  
W/°C  
Linear derating factor (PCB mount) e  
Single pulse avalanche energy b  
Repetitive avalanche current a  
EAS  
IAR  
mJ  
A
-3.6  
Repetitive avalanche energy a  
EAR  
4.2  
mJ  
Maximum power dissipation  
T
C = 25 °C  
42  
PD  
W
V/ns  
°C  
Maximum power dissipation (PCB mount) e  
Peak diode recovery dV/dt c  
TA = 25 °C  
2.5  
dV/dt  
-5.0  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d  
TJ, Tstg  
-55 to +150  
260  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = - 50 V, Starting TJ = 25 °C, L = 35 mH, Rg = 25 Ω, IAS = - 3.6 A (see fig. 12)  
c. ISD - 3.9 A, dI/dt 95 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0373-Rev. F, 19-Apr-2021  
Document Number: 91283  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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