IRFR9220, IRFU9220, SiHFR9220, SiHFU9220
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
S
• Dynamic dV/dt rating
DPAK
(TO-252)
IPAK
(TO-251)
• Repetitive avalanche rated
• Surface-mount (IRFR9220, SiHFR9220)
• Straight lead (IRFUFU9220, SiHFU9220)
G
D
D
Available
• Available in tape and reel
S
• P-channel
G
S
D
G
• Fast switching
D
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
P-Channel MOSFET
PRODUCT SUMMARY
DESCRIPTION
VDS (V)
-200
Third power MOSFETs technology is the key to Vishay
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of the Power MOSFETs
design achieve very low on-state resistance combined with
high transconductance and extreme device ruggedness.
RDS(on) (Ω)
VGS = -10 V
1.5
Qg (Max.) (nC)
20
3.3
Q
gs (nC)
gd (nC)
Q
11
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface-mount applications.
Configuration
Single
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IPAK (TO-251)
SiHFR9220-GE3
SiHFR9220TRL-GE3 a SiHFR9220TRR-GE3 a SiHFR9220TR-GE3 a SiHFU9220-GE3
Lead (Pb)-free and
halogen-free
IRFR9220PbF-BE3 IRFR9220TRPbF-BE3
IRFR9220PbF
IRFR9220TRLPbFa
-
-
-
Lead (Pb)-free
IRFR9220TRRPbFa
IRFR9220TRPbFa
IRFU9220PbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-200
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
T
C = 25 °C
-3.6
Continuous drain current
VGS at -10 V
ID
TC = 100 °C
-2.3
A
Pulsed drain current a
IDM
-14
Linear derating factor
0.33
0.020
310
W/°C
Linear derating factor (PCB mount) e
Single pulse avalanche energy b
Repetitive avalanche current a
EAS
IAR
mJ
A
-3.6
Repetitive avalanche energy a
EAR
4.2
mJ
Maximum power dissipation
T
C = 25 °C
42
PD
W
V/ns
°C
Maximum power dissipation (PCB mount) e
Peak diode recovery dV/dt c
TA = 25 °C
2.5
dV/dt
-5.0
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = - 50 V, Starting TJ = 25 °C, L = 35 mH, Rg = 25 Ω, IAS = - 3.6 A (see fig. 12)
c. ISD ≤ - 3.9 A, dI/dt ≤ 95 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0373-Rev. F, 19-Apr-2021
Document Number: 91283
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000