IRFR9220, IRFU9220, SiHFR9220, SiHFU9220
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
- 200
Available
• Repetitive Avalanche Rated
RDS(on) (Ω)
VGS = - 10 V
1.5
RoHS*
• Surface Mount (IRFR9220/SiHFR9220)
• Straight Lead (IRFUFU9220/SiHFU9220)
• Available in Tape and Reel
• P-Channel
Qg (Max.) (nC)
20
3.3
COMPLIANT
Q
Q
gs (nC)
gd (nC)
11
Configuration
Single
• Fast Switching
S
• Lead (Pb)-free Available
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
G
Third Power MOSFETs technology is the key to Vishay
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of the Power MOSFETs
design achieve very low on-state resistance combined with
high transconductance and extreme device ruggedness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
D
P-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR9220PbF
SiHFR9220-E3
IRFR9220
DPAK (TO-252)
IIRFR9220TRLPbFa
SiHFR9220TL-E3a
IRFR9220TRLa
DPAK (TO-252)
IRFR9220TRRPbFa
SiHFR9220TR-E3a
IRFR9220TRRa
SiHFR9220TRa
DPAK (TO-252)
IRFR9220TRPbFa
SiHFR9220T-E3a
IRFR9220TRa
IPAK (TO-251)
IRFU9220PbF
SiHFU9220-E3
IRFU9220
Lead (Pb)-free
SnPb
SiHFR9220
SiHFR9220TLa
SiHFR9220Ta
SiHFU9220
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
- 200
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
T
C = 25 °C
- 3.6
- 2.3
- 14
0.33
0.020
310
Continuous Drain Current
VGS at - 10 V
ID
TC =100°C
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
- 3.6
4.2
Repetitive Avalanche Energya
EAR
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
42
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
- 5.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 50 V, Starting TJ = 25 °C, L = 35 mH, RG = 25 Ω, IAS = - 3.6 A (see fig. 12).
c. ISD ≤ - 3.9 A, dI/dt ≤ 95 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
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