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IRFR9210TR PDF预览

IRFR9210TR

更新时间: 2024-09-15 12:04:59
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关
页数 文件大小 规格书
7页 4098K
描述
Power MOSFET

IRFR9210TR 数据手册

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IRFR9210, IRFU9210, SiHFR9210, SiHFU9210  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
- 200  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
VGS = - 10 V  
3.0  
RoHS*  
• Surface Mount (IRFR9210/SiHFR9210)  
• Straight Lead (IRFU9210/SiHFU9210)  
• Available in Tape and Reel  
• P-Channel  
Qg (Max.) (nC)  
8.9  
2.1  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
3.9  
Configuration  
Single  
• Fast Switching  
S
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
G
The Power MOSFETs technology is the key to Vishay’s  
advanced line of Power MOSFET transistors. The efficient  
geometry and unique processing of the Power MOSFET  
design achieve very low on-state resistance combined with  
high transconductance and extreme device ruggedness.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
-
IPAK (TO-251)  
IRFU9210PbF  
SiHFU9210-E3  
IRFU9210  
IRFR9210PbF  
SiHFR9210-E3  
IRFR9210  
IRFR9210TRPbFa  
SiHFR9210T-E3a  
IRFR9210TRa  
Lead (Pb)-free  
-
IRFR9210TRLa  
SiHFR9210TLa  
SnPb  
SiHFR9210  
SiHFR9210Ta  
SiHFU9210  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
- 200  
20  
V
TC = 25 °C  
TC =100°C  
- 1.9  
- 1.2  
- 7.6  
0.20  
0.020  
300  
Continuous Drain Current  
V
GS at - 10 V  
ID  
A
Pulsed Drain Currenta  
Linear Derating Factor  
IDM  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
EAR  
mJ  
A
mJ  
- 1.9  
2.5  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TC = 25 °C  
TA = 25 °C  
25  
2.5  
PD  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
- 5.0  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 50 V, starting TJ = 25 °C, L = 124 mH, RG = 25 Ω, IAS = - 1.9 A (see fig. 12).  
c. ISD - 1.9 A, dI/dt 70 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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TRANSISTOR | MOSFET | P-CHANNEL | 150V V(BR)DSS | 2A I(D) | TO-252AA