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IRFR2307ZTRR PDF预览

IRFR2307ZTRR

更新时间: 2024-11-04 12:46:27
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
11页 4090K
描述
Advanced Process Technology

IRFR2307ZTRR 数据手册

 浏览型号IRFR2307ZTRR的Datasheet PDF文件第2页浏览型号IRFR2307ZTRR的Datasheet PDF文件第3页浏览型号IRFR2307ZTRR的Datasheet PDF文件第4页浏览型号IRFR2307ZTRR的Datasheet PDF文件第5页浏览型号IRFR2307ZTRR的Datasheet PDF文件第6页浏览型号IRFR2307ZTRR的Datasheet PDF文件第7页 
AUIRFR2307Z  
Features  
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
V(BR)DSS  
75V  
16m  
RDS(on) max.  
ID (Silicon Limited)  
ID (Package Limited)  
G
53A  
42A  
S
Description  
D
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low on-  
resistance per silicon area. Additional features of this  
design are a 175°C junction operating temperature,  
fast switching speed and improved repetitive ava-  
lanche rating . These features combine to make this  
design an extremely efficient and reliable device for  
use in Automotive applications and a wide variety of  
other applications.  
S
G
D-Pak  
AUIRFR2307Z  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
53  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Units  
(Silicon Limited)  
I
I
I
I
@ T = 25°C  
C
D
D
D
38  
A
@ T = 100°C  
C
(Package Limited)  
42  
@ T = 25°C  
C
210  
DM  
110  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.70  
Linear Derating Factor  
Gate-to-Source Voltage  
± 20  
V
GS  
EAS  
100  
140  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
mJ  
-55 to + 175  
300  
T
T
Operating Junction and  
J
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.42  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
www.kersemi.com  
1
07/23/2010  

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