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IRFR2405TRRPBF PDF预览

IRFR2405TRRPBF

更新时间: 2024-11-26 13:08:47
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英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 131K
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IRFR2405TRRPBF 数据手册

 浏览型号IRFR2405TRRPBF的Datasheet PDF文件第2页浏览型号IRFR2405TRRPBF的Datasheet PDF文件第3页浏览型号IRFR2405TRRPBF的Datasheet PDF文件第4页浏览型号IRFR2405TRRPBF的Datasheet PDF文件第5页浏览型号IRFR2405TRRPBF的Datasheet PDF文件第6页浏览型号IRFR2405TRRPBF的Datasheet PDF文件第7页 
PD - 93861  
IRFR2405  
IRFU2405  
HEXFET® Power MOSFET  
l Surface Mount (IRFR2405)  
l Straight Lead (IRFU2405)  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l Fast Switching  
D
VDSS = 55V  
RDS(on) = 0.016Ω  
G
l Fully Avalanche Rated  
Description  
ID = 56A†  
Seventh Generation HEXFET® Power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance per  
silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable  
device for use in a wide variety of applications.  
S
The D-Pak is designed for surface mounting using  
vapor phase, infrared, or wave soldering techniques.  
The straight lead version (IRFU series) is for through-  
hole mounting applications. Power dissipation levels  
up to 1.5 watts are possible in typical surface mount  
applications.  
D-Pak  
IRFR2405  
I-Pak  
IRFU2405  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
56†  
40†  
220  
110  
0.71  
± 20  
130  
34  
A
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
11  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
1.4  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)*  
Junction-to-Ambient  
°C/W  
110  
*
When mounted on 1" square PCB (FR-4 or G-10 Material) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
www.irf.com  
1
3/1/00  

IRFR2405TRRPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRFR2405TRPBF INFINEON

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