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IRFP460

更新时间: 2024-01-02 05:46:43
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 136K
描述
Power MOSFET

IRFP460 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:TO-247包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:compliant
风险等级:5.1Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):960 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (ID):20 A最大漏源导通电阻:0.27 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):80 A
认证状态:Not Qualified表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFP460 数据手册

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IRFP460, SiHFP460  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
500  
Available  
• Repetitive Avalanche Rated  
• Isolated Central Mounting Hole  
• Fast Switching  
R
DS(on) (Ω)  
VGS = 10 V  
0.27  
RoHS*  
Qg (Max.) (nC)  
210  
29  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
110  
• Ease of Paralleling  
Configuration  
Single  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
D
TO-247  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of  
TO-220 devices. The TO-247 is similar but superior to the  
earlier TO-218 package because its isolated mounting hole.  
It also provides greater creepage distances between pins to  
meet the requirements of most safety specifications.  
G
S
D
S
G
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-247  
IRFP460PbF  
SiHFP460-E3  
IRFP460  
Lead (Pb)-free  
SnPb  
SiHFP460  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
500  
V
VGS  
20  
TC = 25 °C  
TC =100°C  
20  
Continuous Drain Current  
V
GS at 10 V  
ID  
13  
A
Pulsed Drain Currenta  
IDM  
80  
Linear Derating Factor  
2.2  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
960  
20  
EAR  
28  
280  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
3.5  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
°C  
for 10 s  
10  
lbf · in  
N · m  
Mounting Torque  
6-32 or M3 screw  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 4.3 mH, RG = 25 Ω, IAS = 20 A (see fig. 12).  
c. ISD 20 A, dI/dt 160 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91237  
S-81360-Rev. A, 28-Jul-08  
www.vishay.com  
1

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