PD-94011A
SMPS MOSFET
IRFP460AS
HEXFET® Power MOSFET
Applications
l SMPS, UPS, Welding and High Speed
VDSS
Rds(on) max
ID
Power Switching
500V
0.27Ω
20A
Benefits
l Dynamic dv/dt Rating
l Repetitive Avalanche Rated
l Isolated Central Mounting Hole
l Fast Switching
l Ease of Paralleling
l Simple Drive Requirements
l Solder plated and leadformed for surface mounting
Description
Third Generation HEXFET®s from International Rectifier provide the
designer with the best combination of fast switching, ruggedized
device design, low on-resistance and cost-effectiveness.
SMD-247
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use of TO-220
devices. The TO-247 is similar but superior to the earlier TO-218
package because of its isolated mounting hole. It also provides
greater creepage distance between pins to meet the requirements of
most safety specifications.
This plated and leadformed version of the TO-247 package allows
the package to be surface mounted in an application.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
20
13
80
A
PD @TC = 25°C
Power Dissipation
280
W
W/°C
V
Linear Derating Factor
2.2
VGS
dv/dt
TJ
Gate-to-Source Voltage
± 30
Peak Diode Recovery dv/dt
Operating Junction and
3.8
V/ns
-55 to + 150
TSTG
Storage Temperature Range
Mounting torqe, 6-32 or M3 screw
Maximum Reflow Temperature
°C
°C
10 lbf•in (1.1N•m)
230 (Time above 183 °C
should not exceed 100s)
Typical SMPS Topologies:
l Full Bridge
l PFC Boost
Notes through ꢀare on page 8
www.irf.com
1
01/17/01