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IRFP460AS PDF预览

IRFP460AS

更新时间: 2024-01-02 08:38:57
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 118K
描述
Power MOSFET(Vdss=500V, Rds(on)max=0.27ohm, Id=20A)

IRFP460AS 数据手册

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PD-94011A  
SMPS MOSFET  
IRFP460AS  
HEXFET® Power MOSFET  
Applications  
l SMPS, UPS, Welding and High Speed  
VDSS  
Rds(on) max  
ID  
Power Switching  
500V  
0.27Ω  
20A  
Benefits  
l Dynamic dv/dt Rating  
l Repetitive Avalanche Rated  
l Isolated Central Mounting Hole  
l Fast Switching  
l Ease of Paralleling  
l Simple Drive Requirements  
l Solder plated and leadformed for surface mounting  
Description  
Third Generation HEXFET®s from International Rectifier provide the  
designer with the best combination of fast switching, ruggedized  
device design, low on-resistance and cost-effectiveness.  
SMD-247  
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of TO-220  
devices. The TO-247 is similar but superior to the earlier TO-218  
package because of its isolated mounting hole. It also provides  
greater creepage distance between pins to meet the requirements of  
most safety specifications.  
This plated and leadformed version of the TO-247 package allows  
the package to be surface mounted in an application.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
20  
13  
80  
A
PD @TC = 25°C  
Power Dissipation  
280  
W
W/°C  
V
Linear Derating Factor  
2.2  
VGS  
dv/dt  
TJ  
Gate-to-Source Voltage  
± 30  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
3.8  
V/ns  
-55 to + 150  
TSTG  
Storage Temperature Range  
Mounting torqe, 6-32 or M3 screw  
Maximum Reflow Temperature  
°C  
°C  
10 lbfin (1.1Nm)  
230 (Time above 183 °C  
should not exceed 100s)  
Typical SMPS Topologies:  
l Full Bridge  
l PFC Boost  
Notes through are on page 8  
www.irf.com  
1
01/17/01  

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