PD - 96274
IRFI4019HG-117P
DIGITAL AUDIO MOSFET
Features
Key Parameters
Integrated Half-Bridge Package
Reduces the Part Count by Half
Facilitates Better PCB Layout
Key Parameters Optimized for Class-D
Audio Amplifier Applications
Low RDS(ON) for Improved Efficiency
Low Qg and Qsw for Better THD and
Improved Efficiency
VDS
150
V
m
RDS(ON) typ. @ 10V
Qg typ.
80
13
nC
nC
Ω
Qsw typ.
4.1
2.5
150
RG(int) typ.
TJ max
°C
Low Qrr for Better THD and Lower EMI
Can Delivery up to 200W per Channel into
8Ω Load in Half-Bridge Configuration
Amplifier
D1
G1
S1/D2
G2
Lead-Free Package
S2
TO-220 Full-Pak 5 PIN
Halogen-Free
G1, G2
Gate
D1, D2
Drain
S1, S2
Source
Description
This Digital Audio MosFET Half-Bridge is specifically designed for Class D audio amplifier applications. It
consists of two power MosFET switches connected in half-bridge configuration. The latest process is used
toachievelowon-resistancepersiliconarea.Furthermore,Gatecharge,body-diodereverserecovery,and
internal Gate resistance are optimized to improve key Class D audio amplifier performance factors such
as efficiency, THD and EMI. These combine to make this Half-Bridge a highly efficient, robust and reliable
device for Class D audio amplifier applications.
Absolute Maximum Ratings
Parameter
Drain-to-Source Voltage
Max.
150
±20
8.7
Units
V
VDS
VGS
Gate-to-Source Voltage
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
6.2
34
EAS
Single Pulse Avalanche Energy
Power Dissipation
77
18
mJ
W
PD @TC = 25°C
PD @TC = 100°C
Power Dissipation
7.2
Linear Derating Factor
Operating Junction and
0.15
W/°C
°C
TJ
-55 to + 150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
300
10lb in (1.1N m)
Mounting torque, 6-32 or M3 screw
Thermal Resistance
Parameter
Typ.
Max.
6.9
Units
Junction-to-Case
Junction-to-Ambient
Rθ
Rθ
–––
–––
JC
65
JA
Notes through are on page 2
www.irf.com
1
10/08/09