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IRFI4410ZPBF PDF预览

IRFI4410ZPBF

更新时间: 2024-10-28 12:46:27
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体开关晶体管脉冲局域网
页数 文件大小 规格书
8页 321K
描述
High Efficiency Synchronous Rectification in SMPS

IRFI4410ZPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.14雪崩能效等级(Eas):310 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):43 A
最大漏极电流 (ID):43 A最大漏源导通电阻:0.0093 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):47 W最大脉冲漏极电流 (IDM):170 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFI4410ZPBF 数据手册

 浏览型号IRFI4410ZPBF的Datasheet PDF文件第2页浏览型号IRFI4410ZPBF的Datasheet PDF文件第3页浏览型号IRFI4410ZPBF的Datasheet PDF文件第4页浏览型号IRFI4410ZPBF的Datasheet PDF文件第5页浏览型号IRFI4410ZPBF的Datasheet PDF文件第6页浏览型号IRFI4410ZPBF的Datasheet PDF文件第7页 
PD - 97475A  
IRFI4410ZPbF  
HEXFET® Power MOSFET  
Applications  
VDSS  
RDS(on) typ.  
100V  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
7.9m  
9.3m  
:
:
max.  
ID  
43A  
Benefits  
D
S
D
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
S
G
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
D
G
TO-220AB Full-Pak  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
Max.  
43  
Units  
A
30  
170  
PD @TC = 25°C  
47  
Maximum Power Dissipation  
Linear Derating Factor  
W
0.3  
W/°C  
V
VGS  
±30  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy d  
EAS (Thermally limited)  
310  
mJ  
°C  
TJ  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Thermal Resistance  
Parameter  
Junction-to-Case f  
Junction-to-Ambient f  
Typ.  
–––  
–––  
Max.  
3.2  
Units  
RθJC  
RθJA  
°C/W  
65  
www.irf.com  
1
4/19/11  

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