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IRFI4227 PDF预览

IRFI4227

更新时间: 2024-10-29 11:15:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 608K
描述
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. 

IRFI4227 数据手册

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IRFI4227PbF  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
Key Parameters  
Key Parameters Optimized for PDP Sustain,  
Energy Recovery and Pass Switch Applications  
Low EPULSE Rating to Reduce Power  
Dissipation in PDP Sustain, Energy Recovery  
and Pass Switch Applications  
VDS max  
DS (Avalanche) typ.  
RDS(ON) typ. @ 10V  
RP max @ TC= 100°C  
200  
V
V
V
240  
21  
m  
A
Low QG for Fast Response  
High Repetitive Peak Current Capability for  
Reliable Operation  
I
47  
TJ max  
150  
°C  
Short Fall & Rise Times for Fast Switching  
150°C Operating Junction Temperature for  
Improved Ruggedness  
Repetitive Avalanche Capability for Robustness and  
Reliability  
S
D
G
TO-220 Full-Pak  
G
D
S
Gate  
Drain  
Source  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch applications in  
Plasma Display Panels. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon  
area and low EPULSE rating. Additional features of this MOSFET are 150°C operating junction temperature and high  
repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable  
device for PDP driving applications  
Standard Pack  
Base Part Number  
Package Type  
Orderable Part Number  
Form  
Quantity  
IRFI4227PbF  
TO-220 Full-Pak  
Tube  
50  
IRFI4227PbF  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
VGS  
Gate-to-Source Voltage  
± 30  
26  
V
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
17  
100  
47  
A
I
RP @ TC = 100°C  
Repetitive Peak Current   
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
PD @TC = 25°C  
PD @TC = 100°C  
46  
W
18  
W/°C  
°C  
0.37  
TJ  
Operating Junction and  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Mounting torque, 6-32 or M3 screw  
-40 to + 150  
300  
TSTG  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Symbol  
RJC  
RJA  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
–––  
Max.  
2.73  
65  
Units  
°C/W  
1
2017-04-27  

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