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IRFI4321PBF

更新时间: 2024-10-28 03:37:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 282K
描述
HEXFET Power MOSFET

IRFI4321PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.24Samacsys Description:MOSFET MOSFT 150V 34A 16mOhm 73nC
雪崩能效等级(Eas):170 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (Abs) (ID):34 A
最大漏极电流 (ID):34 A最大漏源导通电阻:0.016 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):46 W
最大脉冲漏极电流 (IDM):140 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:MATTE TIN OVER NICKEL端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRFI4321PBF 数据手册

 浏览型号IRFI4321PBF的Datasheet PDF文件第2页浏览型号IRFI4321PBF的Datasheet PDF文件第3页浏览型号IRFI4321PBF的Datasheet PDF文件第4页浏览型号IRFI4321PBF的Datasheet PDF文件第5页浏览型号IRFI4321PBF的Datasheet PDF文件第6页浏览型号IRFI4321PBF的Datasheet PDF文件第7页 
PD - 97104  
IRFI4321PbF  
HEXFET® Power MOSFET  
Applications  
l Motion Control Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l Hard Switched and High Frequency Circuits  
VDSS  
RDS(on) typ.  
150V  
12.2m:  
16m:  
34A  
max.  
Benefits  
l Low RDSON Reduces Losses  
l Low Gate Charge Improves the Switching  
Performance  
l Improved Diode Recovery Improves Switching &  
EMI Performance  
ID  
D
S
D
l 30V Gate Voltage Rating Improves Robustness  
l Fully Characterized Avalanche SOA  
S
G
D
G
TO-220AB Full-Pak  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
Max.  
34  
Units  
A
21  
140  
PD @TC = 25°C  
46  
Maximum Power Dissipation  
Linear Derating Factor  
W
0.37  
W/°C  
V
VGS  
±30  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy d  
EAS (Thermally limited)  
170  
mJ  
°C  
TJ  
-55 to + 150  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Thermal Resistance  
Parameter  
Junction-to-Case f  
Junction-to-Ambient f  
Typ.  
–––  
–––  
Max.  
2.73  
65  
Units  
RθJC  
RθJA  
°C/W  
www.irf.com  
1
6/23/06  

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