PD - 94084A
IRFB17N50L
SMPS MOSFET
HEXFET® Power MOSFET
Applications
l Switch Mode Power Supply (SMPS)
l Uninterruptible Power Supply
l High Speed Power Switching
l ZVS and High Frequency Circuit
l PWM Inverters
VDSS
500V
RDS(on) typ.
ID
16A
0.28Ω
Benefits
l Low Gate Charge Qg results in Simple Drive Requirement
l Improved Gate, Avalanche and Dynamic dv/dt Ruggedness
l Fully Characterized Capacitance and Avalanche Voltage
and Current
l Low Trr and Soft Diode Recovery
TO-220AB
l High Performance Optimised Anti-parallel Diode
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
16
11
A
64
220
PD @TC = 25°C
Power Dissipation
W
W/°C
V
Linear Derating Factor
1.8
VGS
dv/dt
TJ
Gate-to-Source Voltage
± 30
Peak Diode Recovery dv/dt
Operating Junction and
13
V/ns
-55 to + 150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case )
300
10
°C
Mounting Torque, 6-32 or M3 screw
lbft.in(N.m)
Diode Characteristics
Symbol
Parameter
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
IS
Continuous Source Current
(Body Diode)
16
––– –––
––– –––
showing the
A
G
ISM
Pulsed Source Current
(Body Diode)
64
integral reverse
p-n junction diode.
S
VSD
trr
Diode Forward Voltage
––– ––– 1.5
––– 170 250
––– 220 330
––– 470 710
––– 810 1210
V
TJ = 25°C, IS = 16A, VGS = 0V
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
IF = 16A
ns
Reverse Recovery Time
Reverse Recovery Charge
di/dt = 100A/µs
Qrr
nC
A
IRRM
ton
Reverse Recovery Current
Forward Turn-On Time
––– 7.3
11
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Typical SMPS Topologies
l
Bridge Converters
l All Zero Voltage Switching
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1
3/28/01