IRFB16N60L, SiHFB16N60L
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Super Fast Body Diode Eliminates the Need for
External Diodes in ZVS Applications
600
Available
RDS(on) (Ω)
VGS = 10 V
0.385
RoHS*
• Lower Gate Charge Results in Simpler Drive
Requirements
COMPLIANT
Qg (Max.) (nC)
100
30
Q
gs (nC)
• Enhanced dV/dt Capabilities Offer Improved Ruggedness
Qgd (nC)
46
Configuration
Single
• Higher Gate Voltage Threshold Offers Improved Noise
Immunity
D
• Lead (Pb)-free Available
TO-220
APPLICATIONS
G
• Zero Voltage Switching SMPS
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control Applications
S
D
S
N-Channel MOSFET
G
ORDERING INFORMATION
Package
TO-220
IRFB16N60LPbF
SiHFB16N60L-E3
IRFB16N60L
Lead (Pb)-free
SnPb
SiHFB16N60L
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
600
V
VGS
30
TC = 25 °C
TC =100°C
16
Continuous Drain Current
VGS at 10 V
ID
10
A
Pulsed Drain Currenta
IDM
60
Linear Derating Factor
2.5
W/°C
mJ
A
Single Pulse Avalanche Energyb
Avalanche Currenta
EAS
IAR
310
16
Repetitive Avalanche Energya
EAR
31
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
310
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
10
- 55 to + 150
300d
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
°C
for 10 s
10
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 2.5 mH, RG = 25 Ω, IAS =16 A, dV/dt = 10 V/ns (see fig. 12a).
c. ISD ≤ 16 A, dI/dt ≤ 340 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
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