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IRF9Z14STRLPBF PDF预览

IRF9Z14STRLPBF

更新时间: 2024-11-18 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 2454K
描述
Power MOSFET

IRF9Z14STRLPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.02
Is Samacsys:N雪崩能效等级(Eas):140 mJ
外壳连接:DRAIN配置:SINGLE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):6.7 A
最大漏极电流 (ID):6.7 A最大漏源导通电阻:0.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):43 W最大脉冲漏极电流 (IDM):27 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF9Z14STRLPBF 数据手册

 浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第2页浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第3页浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第4页浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第5页浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第6页浏览型号IRF9Z14STRLPBF的Datasheet PDF文件第7页 
IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Advanced Process Technology  
- 60  
• Surface Mount (IRF9Z14S/SiHF9Z14S)  
Available  
RDS(on) (Ω)  
VGS = - 10 V  
0.50  
Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
12  
3.8  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
5.1  
• P-Channel  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
Configuration  
Single  
DESCRIPTION  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
S
D2PAK (TO-263)  
I2PAK (TO-262)  
G
G
D
S
The D2PAK is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in  
any existing surface mount package. The D2PAK is suitable  
for high current applications because of is low internal  
connection resistance and can dissipate up to 2.0 W in a  
typical surface mount application.  
D
P-Channel MOSFET  
The through-hole version (IRF9Z14L/SiHF9Z14L) is  
available for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRF9Z14SPbF  
SiHF9Z14S-E3  
IRF9Z14S  
D2PAK (TO-263)  
IRF9Z14STRLPbFa  
SiHF9Z14STL-E3a  
IRF9Z14STRLa  
I2PAK (TO-262)  
IRF9Z14LPbF  
Lead (Pb)-free  
SiHF9Z14L-E3  
-
-
SnPb  
SiHF9Z14S  
SiHF9Z14STLa  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
- 60  
20  
V
T
C = 25 °C  
- 6.7  
- 4.7  
- 27  
0.29  
140  
- 6.7  
4.3  
Continuous Drain Currente  
VGS at - 10 V  
ID  
TC =100°C  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
W/°C  
mJ  
A
EAS  
IAR  
Repetiitive Avalanche Energya  
EAR  
mJ  
T
C = 25 °C  
3.7  
Maximum Power Dissipation  
PD  
W
TA = 25 °C  
43  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91089  
S-Pending-Rev. A, 02-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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