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IRF1405ZSPBF

更新时间: 2024-11-29 04:23:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
13页 809K
描述
AUTOMOTIVE MOSFET ( VDSS = 55V , RDS(on) = 4.9mヘ , ID = 75A )

IRF1405ZSPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, PLASTIC, D2PAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.46
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):420 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):150 A最大漏极电流 (ID):75 A
最大漏源导通电阻:0.0049 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):230 W
最大脉冲漏极电流 (IDM):600 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF1405ZSPBF 数据手册

 浏览型号IRF1405ZSPBF的Datasheet PDF文件第2页浏览型号IRF1405ZSPBF的Datasheet PDF文件第3页浏览型号IRF1405ZSPBF的Datasheet PDF文件第4页浏览型号IRF1405ZSPBF的Datasheet PDF文件第5页浏览型号IRF1405ZSPBF的Datasheet PDF文件第6页浏览型号IRF1405ZSPBF的Datasheet PDF文件第7页 
PD - 97018  
IRF1405ZPbF  
IRF1405ZSPbF  
AUTOMOTIVE MOSFET  
IRF1405ZLPbF  
Features  
HEXFET® Power MOSFET  
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
D
VDSS = 55V  
RDS(on) = 4.9mΩ  
G
ID = 75A  
Description  
S
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea. Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitive avalanche rating . These features com-  
binetomakethisdesignanextremelyefficientand  
reliable device for use in Automotive applications  
and a wide variety of other applications.  
D2Pak  
TO-262  
TO-220AB  
IRF1405ZPbF  
IRF1405ZSPbF IRF1405ZLPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
150  
110  
75  
Units  
I
I
I
I
@ T = 25°C  
C
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
D
D
D
@ T = 100°C  
C
A
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
@ T = 25°C  
C
600  
230  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
1.5  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS (Thermally limited)  
270  
420  
mJ  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (Tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
mJ  
Repetitive Avalanche Energy  
Operating Junction and  
T
J
-55 to + 175  
T
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
STG  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.65  
–––  
62  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
Junction-to-Case  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
–––  
40  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
07/22/05  

IRF1405ZSPBF 替代型号

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IRF1405ZSTRLPBF INFINEON

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