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IRF1407STRR PDF预览

IRF1407STRR

更新时间: 2024-09-12 23:58:51
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
11页 161K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 75V V(BR)DSS | 100A I(D) | TO-263AB

IRF1407STRR 数据手册

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PD -94335  
IRF1407S  
IRF1407L  
HEXFET® Power MOSFET  
Benefits  
Advanced Process Technology  
Ultra Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
D
VDSS = 75V  
Repetitive Avalanche Allowed up to Tjmax  
R
DS(on) = 0.0078Ω  
Description  
G
AdvancedHEXFET® PowerMOSFETsfromInternational  
Rectifierutilizeadvancedprocessingtechniquestoachieve  
extremelylowon-resistancepersiliconarea. Thisbenefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are well  
knownfor,providesthedesignerwithanextremelyefficient  
andreliabledeviceforuseinawidevarietyofapplications.  
The D2Pak is a surface mount power package capable of  
accommodatingdiesizesuptoHEX-4. Itprovidesthehighest  
powercapabilityandthelowestpossibleon-resistanceinany  
existing surface mount package. The D2Pak is suitable for  
highcurrentapplicationsbecauseofitslowinternalconnection  
resistance and can dissipate up to 2.0W in a typical surface  
mount application.  
ID = 100A†  
S
D2Pak  
TO-262  
IRF1407S  
IRF1407L  
The through-hole version (IRF1407L) is available for low-  
profile applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10Vˆ  
Continuous Drain Current, VGS @ 10Vˆ  
Pulsed Drain Current ˆ  
100†  
70†  
A
520  
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
3.8  
W
W
Power Dissipation  
200  
Linear Derating Factor  
1.3  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
390  
Single Pulse Avalanche Energy‚ˆ  
Avalanche Current  
mJ  
A
See Fig.12a, 12b, 15, 16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy‡  
Peak Diode Recovery dv/dt ƒˆ  
Operating Junction and  
mJ  
V/ns  
4.6  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.75  
40  
Units  
°C/W  
RθJC  
RθJA  
Junction-to-Case  
Junction-to-Ambient(PCB Mounted,steady-state)**  
–––  
**When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer  
to application note #AN-994.  
www.irf.com  
1
10/05/01  

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