HUF75631P3, HUF75631S3S
TM
Data Sheet
July 2000
File Number 4720.2
33A, 100V, 0.040 Ohm, N-Channel,
UltraFET Power MOSFET
®
Packaging
JEDEC TO-220AB
JEDEC TO-263AB
Features
SOURCE
DRAIN
GATE
DRAIN
(FLANGE)
• Ultra Low On-Resistance
- r = 0.040Ω, VGS = 10V
DS(ON)
• Simulation Models
®
™
- Temperature Compensated PSPICE and SABER
Electrical Models
GATE
SOURCE
DRAIN
(FLANGE)
- Spice and SABER Thermal Impedance Models
- www.intersil.com
HUF75631P3
HUF75631S3S
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
Ordering Information
D
S
PART NUMBER
PACKAGE
TO-220AB
TO-263AB
BRAND
75631P
75631S
HUF75631P3
G
HUF75631S3S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF75631S3ST.
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
HUF75631P3
HUF75631S3S
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
±20
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
o
Continuous (T = 25 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
33
23
A
A
C
GS
D
D
o
Continuous (T = 100 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
C
GS
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures 6, 14, 15
120
0.80
W
W/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
o
300
260
C
C
L
o
pkg
NOTE:
1. T = 25 C to 150 C.
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
UltraFET® is a registered trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.
SABER™ is a trademark of Analogy, Inc.
1
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