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HUF75631S3S PDF预览

HUF75631S3S

更新时间: 2024-11-13 23:56:55
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其他 - ETC 晶体晶体管开关
页数 文件大小 规格书
9页 126K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 100V V(BR)DSS | 33A I(D) | TO-263AB

HUF75631S3S 数据手册

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HUF75631P3, HUF75631S3S  
TM  
Data Sheet  
July 2000  
File Number 4720.2  
33A, 100V, 0.040 Ohm, N-Channel,  
UltraFET Power MOSFET  
®
Packaging  
JEDEC TO-220AB  
JEDEC TO-263AB  
Features  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
• Ultra Low On-Resistance  
- r = 0.040Ω, VGS = 10V  
DS(ON)  
• Simulation Models  
®
- Temperature Compensated PSPICE and SABER  
Electrical Models  
GATE  
SOURCE  
DRAIN  
(FLANGE)  
- Spice and SABER Thermal Impedance Models  
- www.intersil.com  
HUF75631P3  
HUF75631S3S  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
Symbol  
Ordering Information  
D
S
PART NUMBER  
PACKAGE  
TO-220AB  
TO-263AB  
BRAND  
75631P  
75631S  
HUF75631P3  
G
HUF75631S3S  
NOTE: When ordering, use the entire part number. Add the suffix T  
to obtain the variant in tape and reel, e.g., HUF75631S3ST.  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
HUF75631P3  
HUF75631S3S  
UNITS  
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
100  
100  
±20  
V
V
V
DSS  
Drain to Gate Voltage (R  
GS  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
33  
23  
A
A
C
GS  
D
D
o
Continuous (T = 100 C, V  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
C
GS  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Figure 4  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Figures 6, 14, 15  
120  
0.80  
W
W/ C  
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 175  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
o
300  
260  
C
C
L
o
pkg  
NOTE:  
1. T = 25 C to 150 C.  
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.  
UltraFET® is a registered trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.  
SABER™ is a trademark of Analogy, Inc.  
1
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000  

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