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HGT1S12N60A4S9A PDF预览

HGT1S12N60A4S9A

更新时间: 2024-01-26 02:03:04
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关双极性晶体管
页数 文件大小 规格书
8页 225K
描述
600V, SMPS Series N-Channel IGBTs

HGT1S12N60A4S9A 数据手册

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HGTP12N60A4, HGTG12N60A4, HGT1S12N60A4S9A  
Handling Precautions for IGBTs  
Operating Frequency Information  
Insulated Gate Bipolar Transistors are susceptible to  
gate-insulation damage by the electrostatic discharge of  
energy through the devices. When handling these devices,  
care should be exercised to assure that the static charge  
built in the handlers body capacitance is not discharged  
through the device. With proper handling and application  
procedures, however, IGBTs are currently being extensively  
used in production by numerous equipment manufacturers in  
military, industrial and consumer applications, with virtually  
no damage problems due to electrostatic discharge. IGBTs  
can be handled safely if the following basic precautions are  
taken:  
Operating frequency information for a typical device  
(Figure 3) is presented as a guide for estimating device  
performance for a specific application. Other typical  
frequency vs collector current (I ) plots are possible using  
CE  
the information shown for a typical unit in Figures 5, 6, 7, 8, 9  
and 11. The operating frequency plot (Figure 3) of a typical  
device shows f  
or f  
; whichever is smaller at each  
MAX1  
MAX2  
point. The information is based on measurements of a  
typical device and is bounded by the maximum rated  
junction temperature.  
f
is defined by f  
= 0.05/(t ).  
+ t  
MAX1  
MAX1  
d(OFF)I d(ON)I  
Deadtime (the denominator) has been arbitrarily held to 10%  
1. Prior to assembly into a circuit, all leads should be kept  
shorted together either by the use of metal shorting  
springs or by the insertion into conductive material such  
as ECCOSORBDLD26or equivalent.  
of the on-state time for a 50% duty factor. Other definitions  
are possible. t  
d(OFF)I  
and t are defined in Figure 21.  
d(ON)I  
Device turn-off delay can establish an additional frequency  
limiting condition for an application other than T  
.
JM  
+ E  
2. When devices are removed by hand from their carriers,  
the hand being used should be grounded by any suitable  
means - for example, with a metallic wristband.  
f
is defined by f  
MAX2  
= (P - P )/(E  
OFF  
). The  
ON2  
MAX2  
D
C
allowable dissipation (P ) is defined by P = (T - T )/R  
.
D
D
JM θJC  
C
The sum of device switching and conduction losses must not  
3. Tips of soldering irons should be grounded.  
exceed P . A 50% duty factor was used (Figure 3) and the  
D
4. Devices should never be inserted into or removed from  
circuits with power on.  
conduction losses (P ) are approximated by  
C
P
= (V x I )/2.  
CE CE  
C
5. Gate Voltage Rating - Never exceed the gate-voltage  
E
and E  
OFF  
are defined in the switching waveforms  
rating of V  
. Exceeding the rated V can result in  
ON2  
GEM  
GE  
permanent damage to the oxide layer in the gate region.  
shown in Figure 21. E  
is the integral of the  
ON2  
instantaneous power loss (I  
x V ) during turn-on and  
6. Gate Termination - The gates of these devices are  
essentially capacitors. Circuits that leave the gate open-  
circuited or floating should be avoided. These conditions  
can result in turn-on of the device due to voltage buildup  
on the input capacitor due to leakage currents or pickup.  
CE  
CE  
E
is the integral of the instantaneous power loss  
OFF  
(I  
x V ) during turn-off. All tail losses are included in the  
CE  
CE  
calculation for E  
; i.e., the collector current equals zero  
OFF  
(I  
= 0).  
CE  
7. Gate Protection - These devices do not have an internal  
monolithic Zener diode from gate to emitter. If gate  
protection is required an external Zener is recommended.  
©2003 Fairchild Semiconductor Corporation  
HGTP12N60A4, HGTG12N60A4, HGT1S12N60A4S9A Rev. B2  

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