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H5MS1G62AFR-E3M PDF预览

H5MS1G62AFR-E3M

更新时间: 2024-11-24 19:53:43
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
66页 1877K
描述
DDR DRAM, 64MX16, 5ns, CMOS, PBGA60, FBGA-60

H5MS1G62AFR-E3M 技术参数

生命周期:Obsolete包装说明:VFBGA,
Reach Compliance Code:compliant风险等级:5.82
访问模式:FOUR BANK PAGE BURST最长访问时间:5 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B60
长度:10 mm内存密度:1073741824 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:60字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
组织:64MX16封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH座面最大高度:1 mm
自我刷新:YES最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:8 mm
Base Number Matches:1

H5MS1G62AFR-E3M 数据手册

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1Gbit MOBILE DDR SDRAM based on 4Bank x 16Mb x16 I/O  
Specification of  
1Gb (64Mx16bit) Mobile DDR SDRAM  
Memory Cell Array  
- Organized as 4banks of 16,777,216 x16  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 1.0 / May. 2009  
1

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