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FQP5N20J69Z PDF预览

FQP5N20J69Z

更新时间: 2024-11-16 15:43:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 局域网开关脉冲晶体管
页数 文件大小 规格书
7页 530K
描述
Power Field-Effect Transistor, 4.5A I(D), 200V, 1.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220, 3 PIN

FQP5N20J69Z 技术参数

生命周期:Obsolete零件包装代码:SFM
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.66Is Samacsys:N
雪崩能效等级(Eas):60 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):4.5 A
最大漏源导通电阻:1.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):28 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQP5N20J69Z 数据手册

 浏览型号FQP5N20J69Z的Datasheet PDF文件第2页浏览型号FQP5N20J69Z的Datasheet PDF文件第3页浏览型号FQP5N20J69Z的Datasheet PDF文件第4页浏览型号FQP5N20J69Z的Datasheet PDF文件第5页浏览型号FQP5N20J69Z的Datasheet PDF文件第6页浏览型号FQP5N20J69Z的Datasheet PDF文件第7页 
QFET N-CHANNEL  
FEATURES  
FQP5N20  
BV  
= 200V  
DSS  
Advanced New Design  
R
= 1.2Ω  
DS(ON)  
Avanced Rugged Technology  
Rugged Gate Oxide Technology  
Very Low Intrinsic Capacitances  
Excellent Switching Characteristics  
Unrivalled Gate Charge: 6.0nC (Typ.)  
Extended Safe Operating Area  
I = 4.5A  
D
TO-220  
1
2
3
Lower R  
: 0.96(Typ.)  
DS(ON)  
1. Gate 2. Drain 3. Source  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Characteristics  
Drain-to-Source Voltage  
Continuous Drain Current (T = 25°C)  
Value  
200  
4.5  
2.8  
28  
Units  
V
V
DSS  
C
I
A
D
Continuous Drain Current (T = 100°C)  
C
I
Drain Current-Pulsed  
V
J
DM  
V
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
±30  
60  
GS  
AS  
AR  
E
mJ  
A
I
4.6  
5.2  
5.5  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
AR  
dv/dt  
Total Power Dissipation (T = 25°C)  
Linear Derating Factor  
52  
0.42  
W
W/°C  
C
P
D
Operating Junction and Storage  
Temperature Range  
T , T  
55 to +150  
J
STG  
°C  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from case for 5-seconds  
T
300  
L
THERMAL RESISTANCE  
Symbol  
Characteristics  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
Units  
R
0.5  
2.4  
θJC  
R
°C/W  
θCS  
R
Junction-to-Ambient  
62.5  
θJA  
REV. B  
1
1999 Fairchild Semiconductor Corporation  

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