Datasheet v3.0
LOW NOISE HIGH FREQUENCY PACKAGED PHEMT
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PACKAGE:
FEATURES:
•
•
•
•
•
•
22 dBm Output Power (P1dB)
15 dB Power Gain (G1dB) at 5.8 GHz
0.8 dB Noise Figure at 5.8 GHz
32 dBm Output IP3 at 5.8 GHz
45% Power-Added Efficiency at 5.8 GHz
Useable Gain to 18 GHz
GENERAL DESCRIPTION:
The FPD6836P70 is a low parasitic, surface
TYPICAL APPLICATIONS:
mountable
pseudomorphic
packaged
High
depletion
Electron
mode
Mobility
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•
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•
Gain blocks and medium power stages
WiMax (2-11GHz)
WLAN 802.11a (5.8GHz)
Transistor (pHEMT) optimised for low noise,
high frequency applications.
Point-to-Point Radio (to 18GHz)
ELECTRICAL SPECIFICATIONS:
PARAMETER
Power at 1dB Gain Compression
Small Signal Gain
SYMBOL
CONDITIONS
VDS = 5 V; IDS = 55mA
VDS = 5 V; IDS = 55mA
MIN
TYP
22
MAX
UNITS
dBm
dB
P1dB
SSG
14
16
Power-Added Efficiency
PAE
VDS = 5 V; IDS = 55mA
POUT = P1dB
45
%
Maximum Stable Gain (S21/S12)
f = 12 GHz
MSG
VDS = 5 V; IDS = 55mA
15
12
f = 18 GHz
Noise Figure
NF
VDS = 5 V; IDS = 55mA,
0.8
32
dB
Output Third-Order Intercept Point
IP3
VDS = 5V; IDS = 55mA
POUT = 10 dBm SCL
dBm
Saturated Drain-Source Current
Maximum Drain-Source Current
Transconductance
IDSS
IMAX
VDS = 1.3 V; VGS = 0 V
90
105
215
140
1
135
mA
mA
mS
VDS = 1.3 V; VGS ≅ +1 V
VDS = 1.3 V; VGS = 0 V
VGS = -5 V
GM
Gate-Source Leakage Current
Pinch-Off Voltage
IGSO
10
µA
V
|VP|
VDS = 1.3 V; IDS = 0.2 mA
IGS = 0.36mA
0.7
12
1.0
14
1.3
Gate-Source Breakdown Voltage
Gate-Drain Breakdown Voltage
Thermal Resistance
|VBDGS|
|VBDGD|
RθJC
V
IGD = 0.36 mA
14.5
16
V
275
°C/W
Note: TAMBIENT = 22°C; RF specification measured at f = 5.8 GHz using CW signal (except as noted)
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com