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FDMS3600S PDF预览

FDMS3600S

更新时间: 2024-11-07 11:59:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体小信号场效应晶体管开关
页数 文件大小 规格书
15页 593K
描述
PowerTrench® Power Stage 25 V Asymmetric Dual N-Channel MOSFET

FDMS3600S 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFN
包装说明:ROHS COMPLIANT, PLASTIC, POWER 56, QFN-9针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.7
Is Samacsys:N外壳连接:DRAIN SOURCE
配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):40 A最大漏极电流 (ID):15 A
最大漏源导通电阻:0.0056 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):90 pFJESD-30 代码:R-PQFP-N7
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:7
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.5 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMS3600S 数据手册

 浏览型号FDMS3600S的Datasheet PDF文件第2页浏览型号FDMS3600S的Datasheet PDF文件第3页浏览型号FDMS3600S的Datasheet PDF文件第4页浏览型号FDMS3600S的Datasheet PDF文件第5页浏览型号FDMS3600S的Datasheet PDF文件第6页浏览型号FDMS3600S的Datasheet PDF文件第7页 
August 2011  
FDMS3600S  
PowerTrench® Power Stage  
25 V Asymmetric Dual N-Channel MOSFET  
Features  
General Description  
Q1: N-Channel  
This device includes two specialized N-Channel MOSFETs in a  
dual PQFN package. The switch node has been internally  
connected to enable easy placement and routing of synchronous  
buck converters. The control MOSFET (Q1) and synchronous  
SyncFET (Q2) have been designed to provide optimal power  
efficiency.  
„ Max rDS(on) = 5.6 mΩ at VGS = 10 V, ID = 15 A  
„ Max rDS(on) = 8.1 mΩ at VGS = 4.5 V, ID = 14 A  
Q2: N-Channel  
„ Max rDS(on) = 1.6 mΩ at VGS = 10 V, ID = 30 A  
„ Max rDS(on) = 2.4 mΩ at VGS = 4.5 V, ID = 25 A  
Applications  
„ Low inductance packaging shortens rise/fall times, resulting in  
„ Computing  
lower switching losses  
„ MOSFET integration enables optimum layout for lower circuit  
inductance and reduced switch node ringing  
„ Communications  
„ General Purpose Point of Load  
„ Notebook VCORE  
„ Server  
„ RoHS Compliant  
G1  
Pin 1  
D1  
D1  
D1  
Q2  
D1  
S2  
D1  
5
6
7
8
4
3
2
1
PHASE  
(S1/D2)  
PHASE  
D1  
D1  
S2  
S2  
G2  
G2  
S2  
S2  
G1  
Q1  
S2  
Bottom  
Top  
Power 56  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Q1  
Q2  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
25  
±20  
30  
25  
±20  
V
V
(Note 3)  
TC = 25 °C  
TC = 25 °C  
TA = 25 °C  
Drain Current  
-Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
40  
65  
151a  
155  
301b  
100  
2005  
2.51b  
1.01d  
ID  
A
-Pulsed  
40  
EAS  
Single Pulse Avalanche Energy  
504  
2.21a  
1.01c  
mJ  
W
Power Dissipation for Single Operation  
Power Dissipation for Single Operation  
Operating and Storage Junction Temperature Range  
TA = 25 °C  
TA = 25 °C  
PD  
TJ, TSTG  
-55 to +150  
°C  
Thermal Characteristics  
RθJA  
RθJA  
RθJC  
Thermal Resistance, Junction to Ambient  
571a  
1251c  
3.5  
501b  
1201d  
2
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Case  
°C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ”  
Tape Width  
Quantity  
22OA  
N9OC  
FDMS3600S  
Power 56  
12 mm  
3000 units  
1
©2011 Fairchild Semiconductor Corporation  
FDMS3600S Rev.C3  
www.fairchildsemi.com  

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