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FDMS3016DC PDF预览

FDMS3016DC

更新时间: 2024-11-07 12:04:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 435K
描述
N-Channel Dual CoolTM PowerTrench MOSFET 30 V, 49 A, 6.0

FDMS3016DC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFN
包装说明:ROHS COMPLIANT, PLASTIC, POWER 56, QFN-8针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.72
其他特性:ULTRA LOW RESISTANCE雪崩能效等级(Eas):72 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):49 A
最大漏极电流 (ID):18 A最大漏源导通电阻:0.006 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MO-240AA
JESD-30 代码:R-PDSO-F5JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):60 W最大脉冲漏极电流 (IDM):200 A
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMS3016DC 数据手册

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July 2010  
FDMS3016DC  
N-Channel Dual CoolTM PowerTrench® MOSFET  
30 V, 49 A, 6.0 mΩ  
Features  
General Description  
„ Dual CoolTM Top Side Cooling PQFN package  
„ Max rDS(on) = 6.0 mΩ at VGS = 10 V, ID = 12 A  
„ Max rDS(on) = 9.0 mΩ at VGS = 4.5 V, ID = 10 A  
„ High performance technology for extremely low rDS(on)  
„ RoHS Compliant  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor’s  
advanced  
PowerTrench®  
process.  
Advancements in both silicon and Dual CoolTM package  
technologies have been combined to offer the lowest rDS(on)  
while maintaining excellent switching performance by extremely  
low Junction-to-Ambient thermal resistance.  
Applications  
„ Synchronous Rectifier for DC/DC Converters  
„ Telecom Secondary Side Rectification  
„ High End Server/Workstation  
Pin 1  
S
S
4
3
2
1
G
S
S
S
S
D
D
D
D
5
6
7
8
G
D
D
D
D
Top  
Power 56  
Bottom  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
±20  
49  
V
V
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
C = 25 °C  
T
78  
ID  
A
TA = 25 °C  
(Note 1a)  
18  
-Pulsed  
200  
72  
EAS  
Single Pulse Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation  
(Note 3)  
(Note 4)  
mJ  
dv/dt  
1.3  
V/ns  
TC = 25 °C  
TA = 25 °C  
60  
PD  
W
Power Dissipation  
(Note 1a)  
3.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJC  
RθJA  
RθJA  
RθJA  
RθJA  
RθJA  
Thermal Resistance, Junction to Case  
(Top Source)  
(Bottom Drain)  
(Note 1a)  
5.7  
2.1  
38  
81  
16  
23  
11  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
(Note 1b)  
°C/W  
(Note 1i)  
(Note 1j)  
(Note 1k)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Dual CoolTM Power 56  
Reel Size  
Tape Width  
12 mm  
Quantity  
3016  
FDMS3016DC  
13’’  
3000 units  
©2010 Fairchild Semiconductor Corporation  
FDMS3016DC Rev.C  
www.fairchildsemi.com  
1

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