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FDD3N50NZ PDF预览

FDD3N50NZ

更新时间: 2024-11-29 12:23:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 550K
描述
N-Channel MOSFET 500V, 2.5A, 2.5

FDD3N50NZ 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.74雪崩能效等级(Eas):114 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (ID):2.5 A
最大漏源导通电阻:2.5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):10 A
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDD3N50NZ 数据手册

 浏览型号FDD3N50NZ的Datasheet PDF文件第2页浏览型号FDD3N50NZ的Datasheet PDF文件第3页浏览型号FDD3N50NZ的Datasheet PDF文件第4页浏览型号FDD3N50NZ的Datasheet PDF文件第5页浏览型号FDD3N50NZ的Datasheet PDF文件第6页浏览型号FDD3N50NZ的Datasheet PDF文件第7页 
November 2011  
TM  
UniFET-II  
FDD3N50NZ  
N-Channel MOSFET  
500V, 2.5A, 2.5  
Features  
Description  
R
= 2.1( Typ.)@ V = 10V, I = 1.25A  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
DS(on)  
GS  
D
Low Gate Charge ( Typ. 6.2nC)  
Low C ( Typ. 2.5pF)  
rss  
This advance technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switching mode power supplies and active power factor  
correction.  
Fast Switching  
100% Avalanche Tested  
Improved dv/dt Capability  
ESD Imoroved Capability  
RoHS Compliant  
D
G
S
D-PAK  
o
MOSFET Maximum Ratings T = 25 C unless otherwise noted*  
C
Symbol  
Parameter  
FDD3N50NZ  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
500  
V
V
DSS  
GSS  
±25  
o
-Continuous (T = 25 C)  
2.5  
C
I
I
Drain Current  
A
D
o
-Continuous (T = 100 C)  
1.5  
C
Drain Current  
- Pulsed  
ꢀꢀꢀ (Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
10  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy  
Avalanche Current  
114  
AS  
I
2.5  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4
mJ  
V/ns  
W
AR  
dv/dt  
10  
40  
o
(T = 25 C)  
C
P
Power Dissipation  
D
o
o
- Derate above 25 C  
0.3  
W/ C  
o
T , T  
Operating and Storage Temperature Range  
-55 to +150  
C
J
STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
o
T
300  
C
L
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Units  
Ratings  
3.1  
R
R
JC  
o
C/W  
90  
JA  
©2011 Fairchild Semiconductor Corporation  
FDD3N50NZ Rev. C0  
1
www.fairchildsemi.com  

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