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EMF5XV6T5 PDF预览

EMF5XV6T5

更新时间: 2024-09-15 03:04:51
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 70K
描述
Power Management, Dual Transistors NPN Silicon Surface Mount Transistors with Monolithic Bias Resistor Network

EMF5XV6T5 数据手册

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EMF5XV6T5  
Preferred Devices  
Power Management,  
Dual Transistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
http://onsemi.com  
Features  
Simplifies Circuit Design  
Reduces Board Space  
(3)  
(2)  
(1)  
Reduces Component Count  
These are Pb−Free Devices  
Q
1
Q
2
MAXIMUM RATINGS  
R
2
R
1
Rating  
Symbol  
Value  
Unit  
(4)  
(5)  
(6)  
Q (T = 25°C unless otherwise noted, common for Q and Q )  
1
A
1
2
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
V
V
50  
50  
Vdc  
Vdc  
CBO  
CEO  
6
I
100  
mAdc  
C
Electrostatic Discharge  
ESD  
HBM Class 1  
MM Class B  
1
Q (T = 25°C)  
2
A
SOT−563  
CASE 463A  
PLASTIC  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
V
−12  
Vdc  
Vdc  
Vdc  
Adc  
CEO  
CBO  
EBO  
V
V
−15  
−6.0  
Collector Current − Peak  
I
−1.0 (Note 1)  
−0.5  
MARKING DIAGRAM  
C
Collector Current − Continuous  
Electrostatic Discharge  
ESD  
HBM Class 3B  
MM Class C  
UY M G  
THERMAL CHARACTERISTICS  
G
Characteristic  
1
(One Junction Heated)  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
D
UY = Specific Device Code  
T = 25°C  
357 (Note 2)  
2.9 (Note 2)  
mW  
mW/°C  
A
M
= Date Code  
Derate above 25°C  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Thermal Resistance,  
Junction-to-Ambient  
R
q
JA  
350 (Note 2)  
°C/W  
Characteristic  
(Both Junctions Heated)  
ORDERING INFORMATION  
Symbol  
Max  
Unit  
Device  
Package  
Shipping  
Total Device Dissipation  
P
D
T = 25°C  
Derate above 25°C  
500 (Note 2)  
4.0 (Note 2)  
mW  
A
EMF5XV6T5  
SOT−563  
(Pb−Free)  
8000/Tape & Reel  
mW/°C  
Thermal Resistance,  
Junction-to-Ambient  
R
250 (Note 2)  
°C/W  
q
JA  
EMF5XV6T5G  
SOT−563  
(Pb−Free)  
8000/Tape & Reel  
Junction and Storage  
Temperature Range  
T , T  
J stg  
55 to +150  
°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. Single pulse 1.0 ms.  
Preferred devices are recommended choices for future use  
2. FR−4 @ Minimum Pad.  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
November, 2005 − Rev. 2  
EMF5XV6T5/D  
 

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