EMF5XV6T5
Preferred Devices
Power Management,
Dual Transistors
NPN Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
http://onsemi.com
Features
• Simplifies Circuit Design
• Reduces Board Space
(3)
(2)
(1)
• Reduces Component Count
• These are Pb−Free Devices
Q
1
Q
2
MAXIMUM RATINGS
R
2
R
1
Rating
Symbol
Value
Unit
(4)
(5)
(6)
Q (T = 25°C unless otherwise noted, common for Q and Q )
1
A
1
2
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
V
V
50
50
Vdc
Vdc
CBO
CEO
6
I
100
mAdc
C
Electrostatic Discharge
ESD
HBM Class 1
MM Class B
1
Q (T = 25°C)
2
A
SOT−563
CASE 463A
PLASTIC
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
V
−12
Vdc
Vdc
Vdc
Adc
CEO
CBO
EBO
V
V
−15
−6.0
Collector Current − Peak
I
−1.0 (Note 1)
−0.5
MARKING DIAGRAM
C
Collector Current − Continuous
Electrostatic Discharge
ESD
HBM Class 3B
MM Class C
UY M G
THERMAL CHARACTERISTICS
G
Characteristic
1
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
P
D
UY = Specific Device Code
T = 25°C
357 (Note 2)
2.9 (Note 2)
mW
mW/°C
A
M
= Date Code
Derate above 25°C
G
= Pb−Free Package
(Note: Microdot may be in either location)
Thermal Resistance,
Junction-to-Ambient
R
q
JA
350 (Note 2)
°C/W
Characteristic
(Both Junctions Heated)
ORDERING INFORMATION
Symbol
Max
Unit
†
Device
Package
Shipping
Total Device Dissipation
P
D
T = 25°C
Derate above 25°C
500 (Note 2)
4.0 (Note 2)
mW
A
EMF5XV6T5
SOT−563
(Pb−Free)
8000/Tape & Reel
mW/°C
Thermal Resistance,
Junction-to-Ambient
R
250 (Note 2)
°C/W
q
JA
EMF5XV6T5G
SOT−563
(Pb−Free)
8000/Tape & Reel
Junction and Storage
Temperature Range
T , T
J stg
−55 to +150
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Single pulse 1.0 ms.
Preferred devices are recommended choices for future use
2. FR−4 @ Minimum Pad.
and best overall value.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
November, 2005 − Rev. 2
EMF5XV6T5/D